AMD XC7Z035-1FFG676I

Manufacturer No:

XC7Z035-1FFG676I

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

Quantity:

Delivery:

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XC7Z035-1FFG676I information

AMD XC7Z035-1FFG676I technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z035-1FFG676I.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Mount
Surface Mount

Package / Case
676-BBGA, FCBGA

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2010

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
676

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
1V

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
S-PBGA-B676

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Max Supply Voltage
1.05V

Min Supply Voltage
950mV

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Propagation Delay
120 ps

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
1

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 275K Logic Cells

Number of Registers
343800

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
27mm

Height Seated (Max)
3.37mm

Width
27mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z035-1FFG676I.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.The system on a chip uses 676 terminations in total.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.It has a maximum supply voltage of 1.05V rated for it.As long as it receives at least 950mV of power, then it is working.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z035-1FFG676I System On Chip (SoC) applications.

Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical

User Guide

PURCHASE

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