AMD XC7Z030-3FFG676E
AMD XC7Z030-3FFG676E

AMD XC7Z030-3FFG676E

Manufacturer No:

XC7Z030-3FFG676E

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

XC7Z030-3FFG676E Information

AMD XC7Z030-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-3FFG676E.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Copper, Silver, Tin
  • Package / Case
  • 676-BBGA, FCBGA
  • Surface Mount
  • YES
  • Number of Pins
  • 676
  • Operating Temperature
  • 0°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq®-7000
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Type
  • Parameter
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 676
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
  • 8542.39.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 245

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.The system on a chip uses 676 terminations in total.By searching XC7Z030, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 1GHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 676 pins.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z030-3FFG676E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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Shipped from:HK Warehouse
Expected Shipping:Fri, Mar 13 - Sat, Mar 14, 2026
Date Code:Within 2 Years

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