AMD XC7Z030-1FBG676C

Manufacturer No:

XC7Z030-1FBG676C

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~85°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

Quantity:

Delivery:

Payment:

In Stock :Available

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XC7Z030-1FBG676C information

AMD XC7Z030-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-1FBG676C.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
676-BBGA, FCBGA

Surface Mount
YES

Number of Pins
676

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2009

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
676

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
245

Supply Voltage
1V

Terminal Pitch
1mm

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
30

Operating Supply Voltage
1V

Supply Voltage-Max (Vsup)
1.05V

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Number of I/O
130

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
-1

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 125K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
27mm

Height Seated (Max)
2.54mm

Radiation Hardening
No

RoHS Status
ROHS3 Compliant

Download datasheets and manufacturer documentation for AMD XC7Z030-1FBG676C.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

A core processor Dual ARM® Cortex®-A9 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines Kintex?-7 FPGA, 125K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 676 pins.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z030-1FBG676C System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

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