AMD XC7Z030-1FBG676C
AMD XC7Z030-1FBG676C

AMD XC7Z030-1FBG676C

Manufacturer No:

XC7Z030-1FBG676C

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~85°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

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In Stock :9996

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Shipped from：HK Warehouse
Expected Shipping：Fri, Oct 16 - Sat, Oct 17, 2026
Date Code：Within 2 Years

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User Guide

Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.

XC7Z030-1FBG676C Information

AMD XC7Z030-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-1FBG676C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Copper, Silver, Tin
  • Package / Case
  • 676-BBGA, FCBGA
  • Surface Mount
  • YES
  • Number of Pins
  • 676
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq®-7000
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Type
  • Parameter
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 676
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
  • 8542.39.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 245

XC7Z030-1FBG676C FAQ

Can I request a quote for XC7Z030-1FBG676C?

XC7Z030-1FBG676C from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.

Why is pricing not shown as a fixed value for XC7Z030-1FBG676C?

The final price for XC7Z030-1FBG676C depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.

Which specifications should I review for XC7Z030-1FBG676C?

XC7Z030-1FBG676C is a AMD Microcontrollers - MCU part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 4 (72 Hours); contact us if you need the specifications verified before sourcing.

When will I receive a quotation for XC7Z030-1FBG676C?

After you submit the RFQ for XC7Z030-1FBG676C, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.

What is the expected shipping time for XC7Z030-1FBG676C?

Once stock for XC7Z030-1FBG676C is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.

Can AIChipLink help find alternatives to XC7Z030-1FBG676C?

Yes. If XC7Z030-1FBG676C is unavailable, end-of-life, or outside your schedule, we can review comparable AMD Microcontrollers - MCU parts and compatible replacement options.