AMD XC7Z030-1FBG484C
AMD XC7Z030-1FBG484C

AMD XC7Z030-1FBG484C

Manufacturer No:

XC7Z030-1FBG484C

Manufacturer:

AMD

Package:

484-BBGA, FCBGA

Description:

484 Terminations 0°C~85°C TJ 484 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XC7Z030-1FBG484C information

AMD XC7Z030-1FBG484C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-1FBG484C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Copper, Silver, Tin
  • Package / Case
  • 484-BBGA, FCBGA
  • Surface Mount
  • YES
  • Number of Pins
  • 484
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq®-7000
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 484
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
  • 8542.39.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 250
  • Supply Voltage
  • 1V
  • Terminal Pitch
  • 1mm
  • Frequency
  • 667MHz
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Operating Supply Voltage
  • 1V
  • Supply Voltage-Max (Vsup)
  • 1.05V
  • Interface
  • CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
  • 130
  • RAM Size
  • 256KB
  • Core Processor
  • Dual ARM® Cortex®-A9 MPCore? with CoreSight?
  • Peripherals
  • DMA
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Data Bus Width
  • 32b
  • Core Architecture
  • ARM
  • Boundary Scan
  • YES
  • Speed Grade
  • -1
  • RAM (words)
  • 256000
  • Primary Attributes
  • Kintex?-7 FPGA, 125K Logic Cells
  • Bus Compatibility
  • CAN; ETHERNET; I2C; SPI; UART; USB
  • Length
  • 23mm
  • Height Seated (Max)
  • 2.54mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z030-1FBG484C.

Datasheets:

Environmental Information:

PCN Design/Specification:

PCN Assembly/Origin:

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).


Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 484 terminations.Searching XC7Z030 will bring up system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z030-1FBG484C System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

User Guide

PURCHASE

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IMPORTANT NOTICE

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Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

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