AMD XC7Z020-L1CLG400I

Manufacturer No:

XC7Z020-L1CLG400I

Manufacturer:

AMD

Package:

400-LFBGA, CSPBGA

Description:

400 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

Quantity:

Delivery:

Payment:

In Stock :Available

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XC7Z020-L1CLG400I information

AMD XC7Z020-L1CLG400I technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z020-L1CLG400I.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Mount
Surface Mount

Package / Case
400-LFBGA, CSPBGA

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2010

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
400

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
1V

Terminal Pitch
0.8mm

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Max Supply Voltage
1.05V

Min Supply Voltage
950mV

Number of I/O
130

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Core Architecture
ARM

Boundary Scan
YES

RAM (words)
256000

Primary Attributes
Artix?-7 FPGA, 85K Logic Cells

Number of Registers
106400

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
17mm

Height Seated (Max)
1.6mm

Width
17mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z020-L1CLG400I.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Manufacturer assigns package 400-LFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Artix?-7 FPGA, 85K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.A system on a chip benefits from having 400 terminations.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a maximum supply voltage of 1.05V.A minimum of 950mV are supplied to it.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.

XC7Z020-L1CLG400I System On Chip (SoC) applications.

Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances

User Guide

PURCHASE

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