AMD XC7Z007S-1CLG225I
Manufacturer No:
XC7Z007S-1CLG225I
Manufacturer:
AMD
Package:
225-LFBGA, CSPBGA
Description:
225 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 54 I/O 1V
Quantity:
In Stock :9042
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XC7Z007S-1CLG225I Information
AMD XC7Z007S-1CLG225I technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z007S-1CLG225I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Package / Case
- 225-LFBGA, CSPBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq®-7000
- Published
- 2016
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 225
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 1V
- Terminal Pitch
- 0.8mm
- Time@Peak Reflow Temperature-Max (s)
- 30
Download datasheets and manufacturer documentation for AMD XC7Z007S-1CLG225I.
Datasheets:
Environmental Information:
This SoC is built on Single ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
A core processor Single ARM® Cortex®-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 225-LFBGA, CSPBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Artix?-7 FPGA, 23K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 54.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.95V.Having 225 terminations in total makes system on a chip possible.SoCs with 667MHz clock frequencies are used in this design.
Single ARM® Cortex®-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG225I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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