AMD XC7Z007S-1CLG225C
AMD XC7Z007S-1CLG225C

AMD XC7Z007S-1CLG225C

Manufacturer No:

XC7Z007S-1CLG225C

Manufacturer:

AMD

Package:

225-LFBGA, CSPBGA

Description:

225 Terminations 0°C~85°C TJ System On Chip Zynq®-7000 Series 54 I/O 1V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XC7Z007S-1CLG225C information

AMD XC7Z007S-1CLG225C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z007S-1CLG225C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Package / Case
  • 225-LFBGA, CSPBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq®-7000
  • Published
  • 2016
  • JESD-609 Code
  • e1
  • Pbfree Code
  • yes
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 225
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 260
  • Supply Voltage
  • 1V
  • Terminal Pitch
  • 0.8mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • JESD-30 Code
  • S-PBGA-B225
  • Supply Voltage-Max (Vsup)
  • 1.05V
  • Supply Voltage-Min (Vsup)
  • 0.95V
  • Number of I/O
  • 54
  • RAM Size
  • 256KB
  • Core Processor
  • Single ARM® Cortex®-A9 MPCore? with CoreSight?
  • Peripherals
  • DMA
  • Clock Frequency
  • 667MHz
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Core Architecture
  • ARM
  • Boundary Scan
  • YES
  • RAM (words)
  • 256000
  • Primary Attributes
  • Artix?-7 FPGA, 23K Logic Cells
  • Bus Compatibility
  • CAN; ETHERNET; I2C; PCI; SPI; UART; USB
  • Length
  • 13mm
  • Height Seated (Max)
  • 1.5mm
  • Width
  • 13mm
  • RoHS Status
  • RoHS Compliant

This SoC is built on Single ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Single ARM® Cortex®-A9 MPCore? with CoreSight? is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 225-LFBGA, CSPBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines Artix?-7 FPGA, 23K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.54 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.In total, there are 225 terminations, so system on a chip is really aided by this.In order to operate the SoC meaning, it must be based on the core architecture of ARM.It operates at a clock frequency of 667MHz.

Single ARM® Cortex®-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
Clock Frequency: 667MHz


There are a lot of Xilinx Inc.


XC7Z007S-1CLG225C System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

User Guide

PURCHASE

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MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.