XC7K325T-L2FFG900E-AMD-Price, Stock & Datasheet

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Step1：Prepare product

Step2：Desiccant Protection

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Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

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XC7K325T-L2FFG900E Information

AMD XC7K325T-L2FFG900E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7K325T-L2FFG900E.

Type
Parameter

Factory Lead Time
11 Weeks

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
900-BBGA, FCBGA

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Kintex®-7

Published
2009

JESD-609 Code
e1

Pbfree Code
yes

Type
Parameter

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
900

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Additional Feature
ALSO OPERATES AT 1 V SUPPLY

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Voltage - Supply
0.87V~0.93V

Download datasheets and manufacturer documentation for AMD XC7K325T-L2FFG900E.

XC7K325T-L2FFG900E Overview

The package that contains this software is called 900-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 500 I/Os for better data transfer. In order to construct a fundamental building block, 326080 logic elements/cells are required. In order for the device to operate, a supply voltage of 0.9V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.87V~0.93V battery. There are many types of FPGAs in the Kintex®-7 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. A device such as this one has 500 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 900 terminations. As far as the RAM bits are concerned, this device offers you a total of 16404480. If you are looking for related parts, you can use the base part number XC7K325T as a starting point. For the program to work properly, the RAM si2MBe of this FPGA module must reach 2MB GB in order to ensure normal operation. 25475 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 0.91.83.3V power supply. A total of 900 pins are included in this device. In this FPGA module, there is a memory of 1GB that can be used to store programs and data. In order to store and transfer data, a total of 407600 registers are used. Furthermore, it can be distinguished by the presence of a feature called ALSO OPERATES AT 1 V SUPPLY. This memory is designed for storing data and avoiding resource conflicts.

XC7K325T-L2FFG900E Features

500 I/Os
Up to 16404480 RAM bits
407600 registers

XC7K325T-L2FFG900E Applications

There are a lot of Xilinx Inc.
XC7K325T-L2FFG900E FPGAs applications.

Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics

XC7K325T-L2FFG900E Relevant information

XC7K325T-L2FFG900E FAQ

Can I request a quote for XC7K325T-L2FFG900E?

XC7K325T-L2FFG900E from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.

Why is pricing not shown as a fixed value for XC7K325T-L2FFG900E?

The final price for XC7K325T-L2FFG900E depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.

Which specifications should I review for XC7K325T-L2FFG900E?

XC7K325T-L2FFG900E is a AMD electronic component part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED and Moisture Sensitivity Level (MSL): 4 (72 Hours); contact us if you need the specifications verified before sourcing.

When will I receive a quotation for XC7K325T-L2FFG900E?

After you submit the RFQ for XC7K325T-L2FFG900E, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.

What is the expected shipping time for XC7K325T-L2FFG900E?

Once stock for XC7K325T-L2FFG900E is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.

Can AIChipLink help find alternatives to XC7K325T-L2FFG900E?

Yes. If XC7K325T-L2FFG900E is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.

AMD XC7K325T-L2FFG900E

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