

AMD XC7K325T-2FBG676C
Manufacturer No:
XC7K325T-2FBG676C
Manufacturer:
Package:
676-BBGA, FCBGA
Description:
2.54mm mm 1GB B FPGAs Kintex®-7 Series 676-BBGA, FCBGA 1mm mm 676
Quantity:
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XC7K325T-2FBG676C Information
AMD XC7K325T-2FBG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7K325T-2FBG676C.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mounting Type
- Surface Mount
- Package / Case
- 676-BBGA, FCBGA
- Surface Mount
- YES
- Number of Pins
- 676
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Kintex®-7
- Published
- 2010
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 676
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
Download datasheets and manufacturer documentation for AMD XC7K325T-2FBG676C.
Datasheets:
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PCN Design/Specification:
PCN Assembly/Origin:
PCN Packaging:
XC7K325T-2FBG676C Description
The XC7K325T-2FBG676C is from Xilinx® 7 series FPGAs.
XC7K325T-2FBG676C Features
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user-configurable analogue interface (XADC), incorporating dual 12-bit 1MSPS analogue-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction
XC7K325T-2FBG676C Applications
Industrial
XC7K325T-2FBG676C Relevant information
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