AMD XC7K325T-1FFG900CES9937
AMD XC7K325T-1FFG900CES9937

AMD XC7K325T-1FFG900CES9937

Manufacturer No:

XC7K325T-1FFG900CES9937

Manufacturer:

AMD

Package:

900-BBGA, FCBGA

Description:

FPGAs Kintex®-7 Series 900-BBGA, FCBGA

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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XC7K325T-1FFG900CES9937 Information

AMD XC7K325T-1FFG900CES9937 technical specifications, attributes, parameters and parts with similar specifications to AMD XC7K325T-1FFG900CES9937.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 900-BBGA, FCBGA
  • Supplier Device Package
  • 900-FCBGA (31x31)
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Kintex®-7
  • Published
  • 2009
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Type
  • Parameter
  • Max Operating Temperature
  • 85°C
  • Min Operating Temperature
  • 0°C
  • Voltage - Supply
  • 0.97V~1.03V
  • Base Part Number
  • XC7K325T
  • Number of I/O
  • 500
  • RAM Size
  • 2MB
  • Number of Logic Elements/Cells
  • 326080
  • Total RAM Bits
  • 16404480
  • Number of LABs/CLBs
  • 25475
  • Number of Logic Blocks (LABs)
  • 25475

XC7K325T-1FFG900CES9937 Overview


A 900-BBGA, FCBGA package is provided with this component. This device features 500 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 326080 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.97V~1.03V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Kintex®-7 series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 16404480. Related parts can be found by using its base part number XC7K325T. The FPGA module's RAM si2MBe reaches 2MB in order to ensure that the program operates in a normal manner. Fpga electronics contains 25475 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. Operating temperatures should exceed 0°C. 25475 logic blocks (LABs) make up its basic building blocks. 900-FCBGA (31x31) stands for its supplier device package.

XC7K325T-1FFG900CES9937 Features


500 I/Os
Up to 16404480 RAM bits
85°C gates
25475 logic blocks (LABs)


XC7K325T-1FFG900CES9937 Applications


There are a lot of Xilinx Inc.
XC7K325T-1FFG900CES9937 FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive

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