

AMD XC7K325T-1FBG900C
Manufacturer No:
XC7K325T-1FBG900C
Manufacturer:
Package:
900-BBGA, FCBGA
Description:
1GB B FPGAs Kintex®-7 Series 900-BBGA, FCBGA
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In Stock :Available
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XC7K325T-1FBG900C information
AMD XC7K325T-1FBG900C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7K325T-1FBG900C.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mounting Type
- Surface Mount
- Package / Case
- 900-BBGA, FCBGA
- Number of Pins
- 900
- Supplier Device Package
- 900-FCBGA (31x31)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Kintex®-7
- Published
- 2009
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Voltage - Supply
- 0.97V~1.03V
- Base Part Number
- XC7K325T
- Max Supply Voltage
- 1.03V
- Min Supply Voltage
- 970mV
- Memory Size
- 1GB
- Number of I/O
- 500
- RAM Size
- 2MB
- Memory Type
- DDR3
- Number of Logic Elements/Cells
- 326080
- Total RAM Bits
- 16404480
- Number of Logic Blocks (LABs)
- 25475
- Speed Grade
- -1
- Number of Registers
- 407600
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC7K325T-1FBG900C.
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XC7K325T-1FBG900C Overview
There is a 900-BBGA, FCBGA package that includes this component. 500 I/Os are available for transferring data more efficiently. A fundamental building block consists of 326080 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.97V~1.03V is needed in order for fpga chips to operate. As part of the Kintex®-7 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 16404480 RAM bits that are available with this device. In order to find related parts, you can use its base part number XC7K325T. There is a maximum RAM si2MBe of 2MB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 900 pins that are designed for it. 25475 LABs and CLBs are built into this FPGA. This module is capable of operating at a maximum temperature of 85°C. 0°C should be higher than the operating temperature. There are a total of 25475 logic blocks (LABs) that form the basic building blocks of this program. Programs and data can be stored in the 1GB memory embedded in this FPGA module. During the process of storing and transferring data, 407600 registers are used. The maximum supply voltage it supports is 1.03V. With a minimum supply voltage of 970mV, it is able to function. There is a device package provided by 900-FCBGA (31x31) as its supplier. Data is stored in the DDR3 memory, so resource conflicts are avoided.
XC7K325T-1FBG900C Features
500 I/Os
Up to 16404480 RAM bits
900 LABs/CLBs
85°C gates
25475 logic blocks (LABs)
407600 registers
XC7K325T-1FBG900C Applications
There are a lot of Xilinx Inc.
XC7K325T-1FBG900C FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
User Guide
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