AMD XC6VLX550T-2FFG1760C
Manufacturer No:
XC6VLX550T-2FFG1760C
Manufacturer:
Package:
1760-BBGA, FCBGA
Description:
FPGAs Virtex®-6 LXT Series 1760-BBGA, FCBGA
Quantity:
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XC6VLX550T-2FFG1760C Information
AMD XC6VLX550T-2FFG1760C technical specifications, attributes, parameters and parts with similar specifications to AMD XC6VLX550T-2FFG1760C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 1760-BBGA, FCBGA
- Number of Pins
- 1760
- Supplier Device Package
- 1760-FCBGA (42.5x42.5)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Virtex®-6 LXT
- Type
- Parameter
- Published
- 2008
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Voltage - Supply
- 0.95V~1.05V
- Base Part Number
- XC6VLX550T
- Max Supply Voltage
- 1.05V
- Min Supply Voltage
- 950mV
- Number of I/O
- 1200
Download datasheets and manufacturer documentation for AMD XC6VLX550T-2FFG1760C.
Datasheets:
Environmental Information:
PCN Design/Specification:
PCN Assembly/Origin:
XC6VLX550T-2FFG1760C Overview
The package that contains this software is called 1760-BBGA, FCBGA. There are 1200 I/Os for better data transfer. In order to construct a fundamental building block, 549888 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.95V~1.05V battery. There are many types of FPGAs in the Virtex®-6 LXT series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 23298048. If you are looking for related parts, you can use the base part number XC6VLX550T as a starting point. For the program to work properly, the RAM si2.8MBe of this FPGA module must reach 2.8MB GB in order to ensure normal operation. In this case, 1760 pins are used in the design. 42960 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. There are 42960 logic blocks (LABs) in the system, which form its basic building blocks. This device is capable of supporting a maximum supply voltage of 1.05V. Using 950mV as the minimum supply voltage, fpga semiconductor can operate. The supplier of the device package is 1760-FCBGA (42.5x42.5).
XC6VLX550T-2FFG1760C Features
1200 I/Os
Up to 23298048 RAM bits
1760 LABs/CLBs
85°C gates
42960 logic blocks (LABs)
XC6VLX550T-2FFG1760C Applications
There are a lot of Xilinx Inc.
XC6VLX550T-2FFG1760C FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
XC6VLX550T-2FFG1760C Relevant information
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