AMD XC6SLX75T-3FGG676I
Manufacturer No:
XC6SLX75T-3FGG676I
Manufacturer:
Package:
676-BGA
Description:
1.2V V 2.44mm mm FPGAs Spartan® 6 LXT Series 676-BGA 1mm mm 676
Quantity:
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XC6SLX75T-3FGG676I Information
AMD XC6SLX75T-3FGG676I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX75T-3FGG676I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 676-BGA
- Number of Pins
- 676
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan® 6 LXT
- Published
- 2008
- JESD-609 Code
- e1
- Type
- Parameter
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 676
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC6SLX75T-3FGG676I.
Datasheets:
Environmental Information:
PCN Design/Specification:
XC6SLX75T-3FGG676I Description
The Xilinx Inc. XC6SLX75T-3FGG676I is a Field Programmable Gate Array (FPGA) that is designed to provide high-performance and flexibility for a wide range of applications. It features a logic cell count of 77,760, and supports up to 550 MHz of maximum operating frequency. The FPGA is built on a 45nm process technology, and comes in a 676-ball grid array (BGA) package. It supports voltage levels of 1.2V, 2.5V, and 3.3V, and has a maximum of 324 I/O pins. The XC6SLX75T-3FGG676I is commonly used in applications such as wireless communication systems, aerospace and defense systems, video and imaging applications, industrial control systems, and scientific and medical applications. It provides high-speed processing and customization options, making it a versatile solution for a wide range of high-performance applications.
XC6SLX75T-3FGG676I Features
DSP Slices: 240
Logic Cells: 77,760
Block RAM: 4.8 Mb
Number of I/Os: 324
System Gates: 6,553,600
Clock Management Tiles: 8
Maximum Frequency: 550 MHz
I/O Voltage: 1.2V, 2.5V, and 3.3V
Package / Case: 676-BGA (27x27)
Operating Temperature Range: -40°C to +100°C
XC6SLX75T-3FGG676I Applications
Communications
Industrial Control
Video and Imaging
Scientific and Medical
Aerospace and Defense
XC6SLX75T-3FGG676I Relevant information
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