AMD XC6SLX75-2FGG484I
AMD XC6SLX75-2FGG484I

AMD XC6SLX75-2FGG484I

Manufacturer No:

XC6SLX75-2FGG484I

Manufacturer:

AMD

Package:

484-BBGA

Description:

1.2V V FPGAs Spartan®-6 LX Series 484-BBGA 1mm mm 484

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IMPORTANT NOTICE

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Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

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SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

XC6SLX75-2FGG484I Information

AMD XC6SLX75-2FGG484I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX75-2FGG484I.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Copper, Silver, Tin
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 484-BBGA
  • Number of Pins
  • 484
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Spartan®-6 LX
  • Published
  • 2008
  • Type
  • Parameter
  • JESD-609 Code
  • e1
  • Pbfree Code
  • yes
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 484
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.14V~1.26V

Download datasheets and manufacturer documentation for AMD XC6SLX75-2FGG484I.

Datasheets:

Environmental Information:

PCN Design/Specification:

 XC6SLX75-2FGG484I Description


A high-performance Field Programmable Gate Array (FPGA) with flexibility and customization for a variety of applications is the Xilinx Inc. XC6SLX75-2FGG484I. It can operate at a maximum frequency of 400 MHz, supports voltage levels of 1.2V, 2.5V, and 3.3V, and contains 77,760 logic cells. The device has a block RAM size of 4.8 Mb and is packaged in a 484-ball grid array (BGA) die. Moreover, it has 240 DSP slices that can be applied to digital signal processing. In wireless communication systems, aircraft and defense systems, video and image applications, industrial control systems, and scientific and medical applications, the XC6SLX75-2FGG484I is frequently utilized.



XC6SLX75-2FGG484I Features


  • I/O Pins

  • Primary Use

  • Package Type

  • Block RAM Size

  • DSP Slice Count

  • Logic Cell Count

  • Voltage Support

  • Clock Management Tiles

  • Operating Temperature Range

  • Maximum Operating Frequency



XC6SLX75-2FGG484I Applications


  • Industrial Control Systems

  • Video and Imaging Applications

  • Aerospace and Defense Systems

  • Wireless Communication Systems

  • Scientific and Medical Applications


XC6SLX75-2FGG484I Relevant information

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Shipped from：HK Warehouse
Expected Shipping：Wed, Apr 1 - Thu, Apr 2, 2026
Date Code：Within 2 Years

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