XC6SLX150T-N3FGG676I-AMD-Price, Stock & Datasheet

XC6SLX150T-N3FGG676I Overview

Fpga chips is supplied in the 676-BGA package. Fpga chips is programmed wFpga chipsh 396 I/Os for transferring data in a more coherent manner. There are 147443 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-6 LXT seies. The operating temperature should be kept at -40°C~100°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 4939776. Its base part number XC6SLX150 can be used to find related parts. The RAM si603kBe of this FPGA module reaches 603kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 676 pins. This FPGA is built as an array of 11519 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 100°C. The operating temperature should be higher than -40°C. Its basic building block is composed of 11519 logic blocks (LABs). There are 184304 registers used to store and transfer data. It employs 676-FBGA (27x27) as its supplier device package.

XC6SLX150T-N3FGG676I Features

396 I/Os
Up to 4939776 RAM bits
676 LABs/CLBs
100°C gates
11519 logic blocks (LABs)
184304 registers

XC6SLX150T-N3FGG676I Applications

There are a lot of Xilinx Inc.
XC6SLX150T-N3FGG676I FPGAs applications.

Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition

AMD XC6SLX150T-N3FGG676I

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