AMD XC6SLX150-3FGG484C
Manufacturer No:
XC6SLX150-3FGG484C
Manufacturer:
Package:
484-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-6 LX Series 484-BBGA 1mm mm 484
Quantity:
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XC6SLX150-3FGG484C Information
AMD XC6SLX150-3FGG484C technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX150-3FGG484C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 484-BBGA
- Number of Pins
- 484
- Number of I/Os
- 338
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-6 LX
- Published
- 2008
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 484
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
- Supply Voltage
- 1.2V
Download datasheets and manufacturer documentation for AMD XC6SLX150-3FGG484C.
Datasheets:
Environmental Information:
PCN Design/Specification:
Product Description:
The Xilinx XC6SLX150-3FGG484C is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc. It belongs to the Spartan-6 LX series and is designed to provide exceptional flexibility and scalability for a wide range of applications. This FPGA features a base part number of XC6SLX150 and is packaged in a 484-ball BGA (Ball Grid Array) package.
Features:
- High clock frequency of 862 MHz
- Combinatorial delay of a CLB-Max of 0.21 ns
- JESD-609 code of e1 for high-speed data transfer
- 338 I/Os, 11519 LABs/CLBs, and 147443 logic elements/cells
- 338 outputs and 484 terminations
- 603kB RAM size
- Operating supply voltage of 1.2V and operating temperature range of 0°C to 85°C TJ
- Pbfree code of yes for environmental compliance
- Peak reflow temperature of 250°C and time at peak reflow temperature of 30 seconds
Applications:
- Primary applications: High-speed data acquisition and processing, digital signal processing, and embedded systems
- Secondary applications: Networking and communication systems, medical devices, and industrial automation
Alternative Parts:
- XC6SLX150-2FGG484C
- XC6SLX150-1FGG484C
- XC6SLX150-2FFG484C
Embedded Modules:
- The XC6SLX150-3FGG484C is used in various embedded modules, including:
- Xilinx Spartan-6 LX FPGA development boards
- High-speed data acquisition and processing systems
- Digital signal processing systems
FAQs:
Q: What is the clock frequency of the XC6SLX150-3FGG484C? A: The clock frequency of the XC6SLX150-3FGG484C is 862 MHz.
Q: What is the combinational delay of a CLB-Max of the XC6SLX150-3FGG484C? A: The combinational delay of a CLB-Max of the XC6SLX150-3FGG484C is 0.21 ns.
Q: What is the JESD-609 code of the XC6SLX150-3FGG484C? A: The JESD-609 code of the XC6SLX150-3FGG484C is e1.
Q: What is the operating supply voltage of the XC6SLX150-3FGG484C? A: The operating supply voltage of the XC6SLX150-3FGG484C is 1.2V.
Q: What is the operating temperature range of the XC6SLX150-3FGG484C? A: The operating temperature range of the XC6SLX150-3FGG484C is 0°C to 85°C TJ.
Q: What is the Pbfree code of the XC6SLX150-3FGG484C? A: The Pbfree code of the XC6SLX150-3FGG484C is yes.
Q: What is the peak reflow temperature of the XC6SLX150-3FGG484C? A: The peak reflow temperature of the XC6SLX150-3FGG484C is 250°C.
Q: What is the time at peak reflow temperature of the XC6SLX150-3FGG484C? A: The time at peak reflow temperature of the XC6SLX150-3FGG484C is 30 seconds.
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