AMD XC6SLX100-2FGG676C

Manufacturer No:

XC6SLX100-2FGG676C

Manufacturer:

AMD

Package:

676-BGA

Description:

1.2V V FPGAs Spartan®-6 LX Series 676-BGA

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XC6SLX100-2FGG676C information

AMD XC6SLX100-2FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX100-2FGG676C.

Type
Parameter

Factory Lead Time
10 Weeks

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
676-BGA

Number of Pins
676

Supplier Device Package
676-FBGA (27x27)

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Spartan®-6 LX

Published
2008

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Max Operating Temperature
85°C

Min Operating Temperature
0°C

Voltage - Supply
1.14V~1.26V

Base Part Number
XC6SLX100

Operating Supply Voltage
1.2V

Number of I/O
480

RAM Size
603kB

Number of Logic Elements/Cells
101261

Total RAM Bits
4939776

Number of LABs/CLBs
7911

Number of Logic Blocks (LABs)
7911

Speed Grade
2

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC6SLX100-2FGG676C.

XC6SLX100-2FGG676C Overview

As part of the 676-BGA package, it is included. A total of 480 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 101261 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . It is a type of FPGA that belongs to the Spartan®-6 LX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 4939776 RAM bits, which is the number of RAM bits that this device offers. Its base part number XC6SLX100 can be used to find parts that are related to it. Fpga electronics is important that this FPGA module has a RAM si603kBe of 603kB in order to ensure that the program will run normally. There are 676 pins on this device. The FPGA consists of 7911 LABs/CLBs. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There is a maximum operating temperature of 85°C for this module. Fpga electronics is recommended that the operating temperature be higher than 0°C. There are 7911 logic blocks (LABs) that make up the system's basic building block. To store and transfer data, there are 126576 registers that are used. This device package is supplied by 676-FBGA (27x27).

XC6SLX100-2FGG676C Features

480 I/Os
Up to 4939776 RAM bits
676 LABs/CLBs
85°C gates
7911 logic blocks (LABs)
126576 registers

XC6SLX100-2FGG676C Applications

There are a lot of Xilinx Inc.
XC6SLX100-2FGG676C FPGAs applications.

Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography

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