AMD XC4062XL-09BG432C

Manufacturer No:

XC4062XL-09BG432C

Manufacturer:

AMD

Package:

432-LBGA Exposed Pad, Metal

Description:

3.3V V FPGAs XC4000E/X Series 432-LBGA Exposed Pad, Metal

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XC4062XL-09BG432C information

AMD XC4062XL-09BG432C technical specifications, attributes, parameters and parts with similar specifications to AMD XC4062XL-09BG432C.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
432-LBGA Exposed Pad, Metal

Number of Pins
432

Supplier Device Package
432-MBGA (40x40)

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
XC4000E/X

Published
1999

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Max Operating Temperature
85°C

Min Operating Temperature
0°C

Voltage - Supply
3V~3.6V

Base Part Number
XC4062XL

Operating Supply Voltage
3.3V

Number of I/O
352

RAM Size
9kB

Number of Logic Elements/Cells
5472

Total RAM Bits
73728

Number of Gates
62000

Number of LABs/CLBs
2304

Number of Logic Blocks (LABs)
2304

Speed Grade
9

Radiation Hardening
No

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XC4062XL-09BG432C.

Datasheets:

xilinxinc-xc4062xl09hq240c-datasheets-7897.pdf

xilinx-xc4062xl09bg432c-datasheets-1960.pdf

XC4062XL-09BG432C Overview

The package that contains this software is called 432-LBGA Exposed Pad, Metal. There are 352 I/Os for better data transfer. In order to construct a fundamental building block, 5472 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 3V~3.6V battery. There are many types of FPGAs in the XC4000E/X series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 73728. If you are looking for related parts, you can use the base part number XC4062XL as a starting point. For the program to work properly, the RAM si9kBe of this FPGA module must reach 9kB GB in order to ensure normal operation. In this case, 432 pins are used in the design. 2304 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 3.3V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 62000 gates. There are 2304 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 5376 registers are used. The supplier of the device package is 432-MBGA (40x40).

XC4062XL-09BG432C Features

352 I/Os
Up to 73728 RAM bits
432 LABs/CLBs
85°C gates
2304 logic blocks (LABs)
5376 registers

XC4062XL-09BG432C Applications

There are a lot of Xilinx Inc.
XC4062XL-09BG432C FPGAs applications.

Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics

User Guide

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