AMD XC4044XL-1HQ240C
AMD XC4044XL-1HQ240C

AMD XC4044XL-1HQ240C

Manufacturer No:

XC4044XL-1HQ240C

Manufacturer:

AMD

Package:

240-BFQFP Exposed Pad

Description:

3.3V V FPGAs XC4000E/X Series 240-BFQFP Exposed Pad 0.5mm mm 240

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC4044XL-1HQ240C information

AMD XC4044XL-1HQ240C technical specifications, attributes, parameters and parts with similar specifications to AMD XC4044XL-1HQ240C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 240-BFQFP Exposed Pad
  • Number of Pins
  • 240
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • XC4000E/X
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 240
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • QUAD
  • Terminal Form
  • GULL WING
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 0.5mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XC4044XL
  • Pin Count
  • 240
  • Number of Outputs
  • 320
  • Number of I/O
  • 193
  • RAM Size
  • 6.3kB
  • Clock Frequency
  • 200MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 3800
  • Total RAM Bits
  • 51200
  • Number of Gates
  • 44000
  • Number of LABs/CLBs
  • 1600
  • Speed Grade
  • 1
  • Number of Registers
  • 3840
  • Number of Equivalent Gates
  • 27000
  • Length
  • 32mm
  • Width
  • 32mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XC4044XL-1HQ240C.

XC4044XL-1HQ240C Overview


Fpga chips is supplied in the 240-BFQFP Exposed Pad package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 193 I/Os for transferring data in a more coherent manner. There are 3800 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 3.3V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 3V~3.6V. It is a type of FPGA belonging to the XC4000E/X seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 320 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 240 terminations. The RAM bits that this device offer is 51200. Its base part number XC4044XL can be used to find related parts. The RAM si6.3kBe of this FPGA module reaches 6.3kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 240 pins. This FPGA is built as an array of 1600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 3.3V, designers can fully make use of its flexibility. Its basic building block contains 44000 gates. Fpga semiconductor is equipped wfpga semiconductorh 240 pin count. Typically, fpga semiconductor uses a crystal oscillating at 200MHz . There are 3840 registers used to store and transfer data. 27000 equivalent gates are used for the design implement in the FPGA.

XC4044XL-1HQ240C Features


193 I/Os
Up to 51200 RAM bits
240 LABs/CLBs
3840 registers


XC4044XL-1HQ240C Applications


There are a lot of Xilinx Inc.
XC4044XL-1HQ240C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition

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Step2:Desiccant Protection

Step2:Desiccant Protection

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Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

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