AMD XC3S700A-4FTG256I
Manufacturer No:
XC3S700A-4FTG256I
Manufacturer:
Package:
256-LBGA
Description:
1.2V V 1.55mm mm FPGAs Spartan®-3A Series 256-LBGA 1mm mm 256
Quantity:
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XC3S700A-4FTG256I Information
AMD XC3S700A-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S700A-4FTG256I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-3A
- Published
- 1999
- JESD-609 Code
- e1
- Type
- Parameter
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- ECCN Code
- EAR99
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
Download datasheets and manufacturer documentation for AMD XC3S700A-4FTG256I.
Datasheets:
Environmental Information:
XC3S700A-4FTG256I Overview
The package that contains this software is called 256-LBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 161 I/Os for better data transfer. In order to construct a fundamental building block, 13248 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-3A series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A device such as this one has 148 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 256 terminations. As far as the RAM bits are concerned, this device offers you a total of 368640. If you are looking for related parts, you can use the base part number XC3S700A as a starting point. For the program to work properly, the RAM si45kBe of this FPGA module must reach 45kB GB in order to ensure normal operation. In this case, 256 pins are used in the design. 1472 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.33.3V power supply. As a basic building block, fpga semiconductor consists of 700000 gates. A total of 256 pins are included in this device. Most of the time, it uses a crystal oscillating at 667MHz to generate the signal.
XC3S700A-4FTG256I Features
161 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
XC3S700A-4FTG256I Applications
There are a lot of Xilinx Inc.
XC3S700A-4FTG256I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
XC3S700A-4FTG256I Relevant information
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