AMD XC3S5000-4FGG900I
Manufacturer No:
XC3S5000-4FGG900I
Manufacturer:
AMD
Package:
900-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-3 Series 900-BBGA 1mm mm 900
Quantity:
In Stock :6443
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Expected Shipping：Sun, Jun 14 - Mon, Jun 15, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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XC3S5000-4FGG900I Information
AMD XC3S5000-4FGG900I technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S5000-4FGG900I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 900-BBGA
- Number of Pins
- 900
- Number of I/Os
- 633
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2009
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 900
- ECCN Code
- 3A991.D
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC3S5000-4FGG900I.
Datasheets:
Environmental Information:
XC3S5000-4FGG900I Overview
As part of the 900-BBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A fundamental building block consists of 74880 logic elements/cells. It is powered from a supply voltage of 1.2V. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . It is a type of FPGA that belongs to the Spartan®-3 series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In this device, there are 633 outputs that can be used. In order to save space, this FPGA model has been contained in Tray. There are a total of 900 terminations. This device has 1916928 RAM bits, which is the number of RAM bits that this device offers. Its base part number XC3S5000 can be used to find parts that are related to it. Fpga electronics is important that this FPGA module has a RAM si234kBe of 234kB in order to ensure that the program will run normally. There are 900 pins on this device. The FPGA consists of 8320 LABs/CLBs. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. An external power supply of 1.21.2/3.32.5V is required to power the device. The basic building block of this system consists of 5000000 gates. There are a total of 900 pins on this device. Typically, it uses a crystal oscillating at 630MHz in order to operate.
XC3S5000-4FGG900I Features
Up to 1916928 RAM bits
900 LABs/CLBs
XC3S5000-4FGG900I Applications
There are a lot of Xilinx Inc.
XC3S5000-4FGG900I FPGAs applications.
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
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