AMD XC3S50-4PQG208C
AMD XC3S50-4PQG208C

AMD XC3S50-4PQG208C

Manufacturer No:

XC3S50-4PQG208C

Manufacturer:

AMD

Package:

208-BFQFP

Description:

1.2V V FPGAs Spartan®-3 Series 630MHz MHz 208-BFQFP 0.5mm mm 208

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC3S50-4PQG208C information

AMD XC3S50-4PQG208C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S50-4PQG208C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Tin
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 208-BFQFP
  • Number of Pins
  • 208
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Spartan®-3
  • Published
  • 2009
  • JESD-609 Code
  • e3
  • Pbfree Code
  • yes
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 208
  • Termination
  • SMD/SMT
  • ECCN Code
  • EAR99
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.14V~1.26V
  • Terminal Position
  • QUAD
  • Terminal Form
  • GULL WING
  • Peak Reflow Temperature (Cel)
  • 245
  • Supply Voltage
  • 1.2V
  • Frequency
  • 630MHz
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XC3S50
  • Pin Count
  • 208
  • Number of Outputs
  • 124
  • Qualification Status
  • Not Qualified
  • Operating Supply Voltage
  • 1.2V
  • Power Supplies
  • 1.21.2/3.32.5V
  • Number of I/O
  • 124
  • RAM Size
  • 9kB
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 1728
  • Total RAM Bits
  • 73728
  • Number of Gates
  • 50000
  • Number of LABs/CLBs
  • 192
  • Speed Grade
  • 4
  • Combinatorial Delay of a CLB-Max
  • 0.61 ns
  • Number of CLBs
  • 192
  • Height
  • 3.4mm
  • Length
  • 28mm
  • Width
  • 28mm
  • REACH SVHC
  • Unknown
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC3S50-4PQG208C.

Datasheets:

Environmental Information:

PCN Assembly/Origin:

XC3S50-4PQG208C Overview


Fpga chips is supplied in the 208-BFQFP package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 124 I/Os for transferring data in a more coherent manner. There are 1728 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3 seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 124 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 208 terminations. The RAM bits that this device offer is 73728. Its base part number XC3S50 can be used to find related parts. The RAM si9kBe of this FPGA module reaches 9kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 208 pins. This FPGA is built as an array of 192 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 50000 gates. Fpga semiconductor is equipped wfpga semiconductorh 208 pin count. 192 CLBs are basic modules used for its architecture. Fpga semiconductor operates at a frequency of 630MHz to deliver high efficiency.

XC3S50-4PQG208C Features


124 I/Os
Up to 73728 RAM bits
208 LABs/CLBs
Operating from a frequency of 630MHz


XC3S50-4PQG208C Applications


There are a lot of Xilinx Inc.
XC3S50-4PQG208C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition

User Guide

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Step2：Desiccant Protection

Step2：Desiccant Protection

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Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

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SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

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