AMD XC3S400-5FGG456C
Manufacturer No:
XC3S400-5FGG456C
Manufacturer:
Package:
456-BBGA
Description:
1.2V V FPGAs Spartan®-3 Series 456-BBGA
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In Stock :Available
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XC3S400-5FGG456C information
AMD XC3S400-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S400-5FGG456C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 456-BBGA
- Number of Pins
- 456
- Supplier Device Package
- 456-FBGA (23x23)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2007
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Voltage - Supply
- 1.14V~1.26V
- Base Part Number
- XC3S400
- Operating Supply Voltage
- 1.2V
- Number of I/O
- 264
- RAM Size
- 36kB
- Number of Logic Elements/Cells
- 8064
- Total RAM Bits
- 294912
- Number of Gates
- 400000
- Number of LABs/CLBs
- 896
- Number of Logic Blocks (LABs)
- 896
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC3S400-5FGG456C.
Datasheets:
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PCN Design/Specification:
XC3S400-5FGG456C Overview
There is a 456-BBGA package that includes this component. 264 I/Os are available for transferring data more efficiently. A fundamental building block consists of 8064 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. As part of the Spartan®-3 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 294912 RAM bits that are available with this device. In order to find related parts, you can use its base part number XC3S400. There is a maximum RAM si36kBe of 36kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 456 pins that are designed for it. 896 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.2V supply voltage. This module is capable of operating at a maximum temperature of 85°C. 0°C should be higher than the operating temperature. There are 400000 gates that make up its basic building block. There are a total of 896 logic blocks (LABs) that form the basic building blocks of this program. There is a device package provided by 456-FBGA (23x23) as its supplier.
XC3S400-5FGG456C Features
264 I/Os
Up to 294912 RAM bits
456 LABs/CLBs
85°C gates
896 logic blocks (LABs)
XC3S400-5FGG456C Applications
There are a lot of Xilinx Inc.
XC3S400-5FGG456C FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
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