AMD XC3S400-4FGG456I
Manufacturer No:
XC3S400-4FGG456I
Manufacturer:
Package:
456-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-3 Series 456-BBGA 1mm mm 456
Quantity:
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XC3S400-4FGG456I Information
AMD XC3S400-4FGG456I technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S400-4FGG456I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 456-BBGA
- Number of Pins
- 456
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2009
- JESD-609 Code
- e1
- Type
- Parameter
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 456
- ECCN Code
- 3A991.D
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
Download datasheets and manufacturer documentation for AMD XC3S400-4FGG456I.
Datasheets:
Environmental Information:
PCN Design/Specification:
XC3S400-4FGG456I Overview
There is a 456-BBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 264 I/Os are available for transferring data more efficiently. A fundamental building block consists of 8064 logic elements/cells. It is powered from a supply voltage of 1.2V. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. As part of the Spartan®-3 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. The device has 264 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 456. There are 294912 RAM bits that are available with this device. In order to find related parts, you can use its base part number XC3S400. There is a maximum RAM si36kBe of 36kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 456 pins that are designed for it. 896 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.2V supply voltage. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. There are 400000 gates that make up its basic building block. As far as the pin count is concerned, it has 456 pins. Usually, fpga semiconductor uses a 630MHz crystal. There are 896 CLBs that make up the architecture of the system.
XC3S400-4FGG456I Features
264 I/Os
Up to 294912 RAM bits
456 LABs/CLBs
XC3S400-4FGG456I Applications
There are a lot of Xilinx Inc.
XC3S400-4FGG456I FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
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