AMD XC3S2000-5FGG456C
Manufacturer No:
XC3S2000-5FGG456C
Manufacturer:
Package:
456-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-3 Series 456-BBGA 1mm mm 456
Quantity:
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XC3S2000-5FGG456C Information
AMD XC3S2000-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S2000-5FGG456C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 456-BBGA
- Number of Pins
- 456
- Number of I/Os
- 333
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2009
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 456
- ECCN Code
- 3A991.D
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC3S2000-5FGG456C.
Datasheets:
Environmental Information:
PCN Design/Specification:
Product Description:
The XC3S2000-5FGG456C is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc., part of the Spartan-3 series. This device is designed to provide a versatile and efficient solution for a wide range of applications, from digital signal processing to embedded systems.
Features:
- High Density: With over 2 million gates, this FPGA offers a high level of integration and density, making it suitable for complex digital designs.
- High-Speed Performance: The XC3S2000-5FGG456C operates at a supply voltage of 1.2V and features a speed grade of 5, ensuring fast and reliable performance.
- Large RAM Capacity: The device boasts a total RAM capacity of 90KB, providing ample memory for storing and processing data.
- Surface Mount Package: The 456-BBGA package is designed for surface mount applications, making it easy to integrate into modern PCB designs.
- RoHS Compliance: The XC3S2000-5FGG456C is ROHS3 compliant, ensuring environmental sustainability and compliance with international regulations.
Applications:
- Primary Applications:
- Digital signal processing
- Embedded systems
- High-speed data processing
- Industrial control systems
- Secondary Applications:
- Aerospace and defense systems
- Automotive systems
- Medical devices
- Networking and communication systems
Alternative Parts:
- XC3S2000-4FGG456C (similar specifications but with a lower speed grade)
- XC3S2000-6FGG456C (similar specifications but with a higher speed grade)
Embedded Modules:
- The XC3S2000-5FGG456C is used in various embedded modules, including:
- Xilinx's own development boards
- Custom-designed PCBs for specific applications
- Industrial control systems
- Medical devices
FAQs:
Q: What is the operating temperature range of the XC3S2000-5FGG456C? A: The operating temperature range is 0°C to 85°C (TJ).
Q: What is the maximum peak reflow temperature of the XC3S2000-5FGG456C? A: The maximum peak reflow temperature is 250°C.
Q: Is the XC3S2000-5FGG456C Pb-free? A: Yes, the XC3S2000-5FGG456C is Pb-free.
Q: What is the packaging type of the XC3S2000-5FGG456C? A: The packaging type is a tray.
Q: What is the ECCN code for the XC3S2000-5FGG456C? A: The ECCN code is 3A991.D.
Q: What is the JESD-609 code for the XC3S2000-5FGG456C? A: The JESD-609 code is e1.
Q: What is the factory lead time for the XC3S2000-5FGG456C? A: The factory lead time is 10 weeks.
Q: What is the moisture sensitivity level (MSL) of the XC3S2000-5FGG456C? A: The MSL is 3 (168 hours).
XC3S2000-5FGG456C Relevant information
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