AMD XC3S2000-4FGG900I

Manufacturer No:

XC3S2000-4FGG900I

Manufacturer:

AMD

Package:

FBGA

Description:

1.2V V FPGAs FBGA 900

Quantity:

In Stock :6785

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Shipped from：HK Warehouse

Expected Shipping：Thu, May 7 - Fri, May 8, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

XC3S2000-4FGG900I Information

AMD XC3S2000-4FGG900I technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S2000-4FGG900I.

Type
Parameter

Factory Lead Time
6 Weeks

Mount
Surface Mount

Package / Case
FBGA

Number of Pins
900

Number of I/Os
565

Published
2005

JESD-609 Code
e1

Pbfree Code
yes

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Type
Parameter

Number of Terminations
900

ECCN Code
3A991.D

Max Operating Temperature
100°C

Min Operating Temperature
-40°C

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
250

Supply Voltage
1.2V

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
900

Download datasheets and manufacturer documentation for AMD XC3S2000-4FGG900I.

Datasheets:

xilinx-xc3s20004fgg900i-datasheets-4032.pdf

XC3S2000-4FGG900I Overview

This package is included in the FBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. With this device, you will be able to make use of 565 outputs. The total number of terminations is 900. During the configuration of this FPGA module, the RAM si90kBe reaches 90kB to ensure that the program runs normally. The device is designed with 900 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.32.5V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 2e+06 gates as fpga semiconductors basic building block. The device has a total of 900 pins on fpga semiconductor. In its basic building block, it is composed of 5120 logic blocks (LABs), which are called building blocks. A crystal oscillating at 630MHz is one of the most common components of this device. In addfpga semiconductorion, fpga semiconductor is able to support a maximum supply voltage of 1.26V. The unit is capable of working with a minimum supply voltage of 1.14V. There are 2000000 equivalent gates in the FPGA that implement the design.