AMD XC3S2000-4FGG456C
Manufacturer No:
XC3S2000-4FGG456C
Manufacturer:
Package:
456-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-3 Series 456-BBGA 1mm mm 456
Quantity:
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XC3S2000-4FGG456C Information
AMD XC3S2000-4FGG456C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S2000-4FGG456C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 456-BBGA
- Number of Pins
- 456
- Number of I/Os
- 333
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2001
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 456
- ECCN Code
- 3A991.D
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC3S2000-4FGG456C.
Datasheets:
Environmental Information:
PCN Design/Specification:
Product Description:
The XC3S2000-4FGG456C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx Inc., part of the Spartan-3 series. This device is designed to provide a robust and flexible solution for a wide range of applications, from digital signal processing to embedded systems.
Features:
- High clock frequency of 630MHz
- Combinatorial delay of a CLB-Max of 0.61 ns
- Large number of gates (2000000), I/Os (333), and logic elements/cells (46080)
- 90kB of RAM and 737280 total RAM bits
- Operating supply voltage of 1.2V and operating temperature range of 0°C to 85°C TJ
- Surface-mount package with 456 pins and a ball grid array (BGA) terminal form
- Pb-free and ROHS3 compliant
Applications:
- Primary applications: Digital signal processing, embedded systems, and high-speed data processing
- Secondary applications: Networking, telecommunications, and aerospace and defense systems
Alternative Parts:
- XC3S2000-4FGG456C is an alternative part to the XC3S2000-4FGG456C, which has the same specifications but is packaged in a different format.
Embedded Modules:
- This component is used in various embedded modules, including:
- Digital signal processing modules
- Embedded system modules
- High-speed data processing modules
FAQs:
Q: What is the clock frequency of the XC3S2000-4FGG456C? A: The clock frequency of the XC3S2000-4FGG456C is 630MHz.
Q: What is the combinatorial delay of a CLB-Max of the XC3S2000-4FGG456C? A: The combinatorial delay of a CLB-Max of the XC3S2000-4FGG456C is 0.61 ns.
Q: What is the operating supply voltage of the XC3S2000-4FGG456C? A: The operating supply voltage of the XC3S2000-4FGG456C is 1.2V.
Q: What is the operating temperature range of the XC3S2000-4FGG456C? A: The operating temperature range of the XC3S2000-4FGG456C is 0°C to 85°C TJ.
Q: Is the XC3S2000-4FGG456C Pb-free and ROHS3 compliant? A: Yes, the XC3S2000-4FGG456C is Pb-free and ROHS3 compliant.
Q: What is the factory lead time for the XC3S2000-4FGG456C? A: The factory lead time for the XC3S2000-4FGG456C is 10 weeks.
Q: What is the moisture sensitivity level (MSL) of the XC3S2000-4FGG456C? A: The MSL of the XC3S2000-4FGG456C is 3 (168 hours).
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