AMD XC3S1600E-5FGG400C

Manufacturer No:

XC3S1600E-5FGG400C

Manufacturer:

AMD

Package:

400-BGA

Description:

1.2V V 2.43mm mm FPGAs Spartan®-3E Series 400-BGA 1mm mm 400

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In Stock :Available

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XC3S1600E-5FGG400C information

AMD XC3S1600E-5FGG400C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S1600E-5FGG400C.

Type
Parameter

Factory Lead Time
10 Weeks

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
400-BGA

Number of Pins
400

Number of I/Os
304

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Spartan®-3E

Published
2009

JESD-609 Code
e1

Pbfree Code
yes

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
400

ECCN Code
3A991.D

Voltage - Supply
1.14V~1.26V

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
250

Supply Voltage
1.2V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC3S1600E

Number of Outputs
132

Qualification Status
Not Qualified

Operating Supply Voltage
1.2V

RAM Size
81kB

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells
33192

Total RAM Bits
663552

Number of Gates
1600000

Number of LABs/CLBs
3688

Speed Grade
5

Number of Registers
29504

Combinatorial Delay of a CLB-Max
0.66 ns

Length
21mm

Height Seated (Max)
2.43mm

Width
21mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC3S1600E-5FGG400C.

XC3S1600E-5FGG400C Overview

Fpga chips is supplied in the 400-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 33192 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 132 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 400 terminations. The RAM bits that this device offer is 663552. Its base part number XC3S1600E can be used to find related parts. The RAM si81kBe of this FPGA module reaches 81kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 400 pins. This FPGA is built as an array of 3688 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Its basic building block contains 1600000 gates. Fpga semiconductor is equipped wfpga semiconductorh 400 pin count. There are 29504 registers used to store and transfer data.

XC3S1600E-5FGG400C Features

Up to 663552 RAM bits
400 LABs/CLBs
29504 registers

XC3S1600E-5FGG400C Applications

There are a lot of Xilinx Inc.
XC3S1600E-5FGG400C FPGAs applications.

Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition

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