AMD XC3S1400AN-4FG676C
Manufacturer No:
XC3S1400AN-4FG676C
Manufacturer:
Package:
676-BBGA, FCBGA
Description:
1.2V V FPGAs Spartan®-3AN Series 676-BBGA, FCBGA 1mm mm 676
Quantity:
Delivery:
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In Stock :Available
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XC3S1400AN-4FG676C information
AMD XC3S1400AN-4FG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S1400AN-4FG676C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 676-BBGA, FCBGA
- Number of Pins
- 676
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3AN
- Published
- 2007
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 676
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Lead (Sn63Pb37)
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
- Supply Voltage
- 1.2V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- XC3S1400AN
- Pin Count
- 676
- Number of Outputs
- 408
- Qualification Status
- Not Qualified
- Operating Supply Voltage
- 1.2V
- Power Supplies
- 1.21.2/3.33.3V
- Number of I/O
- 502
- RAM Size
- 72kB
- Clock Frequency
- 667MHz
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 25344
- Total RAM Bits
- 589824
- Number of Gates
- 1400000
- Number of LABs/CLBs
- 2816
- Speed Grade
- 4
- Combinatorial Delay of a CLB-Max
- 0.71 ns
- Length
- 27mm
- Width
- 27mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC3S1400AN-4FG676C.
Datasheets:
PCN Design/Specification:
XC3S1400AN-4FG676C Overview
Fpga chips is supplied in the 676-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 502 I/Os for transferring data in a more coherent manner. There are 25344 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3AN seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 408 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 676 terminations. The RAM bits that this device offer is 589824. Its base part number XC3S1400AN can be used to find related parts. The RAM si72kBe of this FPGA module reaches 72kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 676 pins. This FPGA is built as an array of 2816 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.33.3V power supply. Its basic building block contains 1400000 gates. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Typically, fpga semiconductor uses a crystal oscillating at 667MHz .
XC3S1400AN-4FG676C Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
XC3S1400AN-4FG676C Applications
There are a lot of Xilinx Inc.
XC3S1400AN-4FG676C FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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