AMD XC3S1200E-5FG320C
AMD XC3S1200E-5FG320C

AMD XC3S1200E-5FG320C

Manufacturer No:

XC3S1200E-5FG320C

Manufacturer:

AMD

Package:

320-BGA

Description:

1.2V V 2mm mm FPGAs Spartan®-3E Series 320-BGA 1mm mm 320

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

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Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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XC3S1200E-5FG320C Information

AMD XC3S1200E-5FG320C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S1200E-5FG320C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 320-BGA
  • Surface Mount
  • YES
  • Number of I/Os
  • 250
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Bulk
  • Series
  • Spartan®-3E
  • Published
  • 2008
  • JESD-609 Code
  • e0
  • Type
  • Parameter
  • Pbfree Code
  • no
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 320
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Lead (Sn/Pb)
  • Voltage - Supply
  • 1.14V~1.26V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225

Download datasheets and manufacturer documentation for AMD XC3S1200E-5FG320C.

XC3S1200E-5FG320C Overview


The package that contains this software is called 320-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. In order to construct a fundamental building block, 19512 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-3E series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 194 outputs built into it. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In total, it has a total of 320 terminations. As far as the RAM bits are concerned, this device offers you a total of 516096. For the program to work properly, the RAM si63kBe of this FPGA module must reach 63kB GB in order to ensure normal operation. 2168 LABs/CLBs are configured on this FPGA. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. As a basic building block, fpga semiconductor consists of 1200000 gates. A total of 320 pins are included in this device. In order to store and transfer data, a total of 17344 registers are used.

XC3S1200E-5FG320C Features


Up to 516096 RAM bits
17344 registers


XC3S1200E-5FG320C Applications


There are a lot of Xilinx Inc.
XC3S1200E-5FG320C FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics

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