AMD XC2V2000-4BG575I
AMD XC2V2000-4BG575I

AMD XC2V2000-4BG575I

Manufacturer No:

XC2V2000-4BG575I

Manufacturer:

AMD

Package:

575-BBGA

Description:

1.5V V 2.6mm mm FPGAs Virtex®-II Series 575-BBGA 1.27mm mm 575

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC2V2000-4BG575I information

AMD XC2V2000-4BG575I technical specifications, attributes, parameters and parts with similar specifications to AMD XC2V2000-4BG575I.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 575-BBGA
  • Number of Pins
  • 575
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®-II
  • Published
  • 2007
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 575
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Lead (Sn63Pb37)
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.425V~1.575V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 1.5V
  • Terminal Pitch
  • 1.27mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 575
  • Number of Outputs
  • 408
  • Operating Supply Voltage
  • 1.5V
  • Power Supplies
  • 1.51.5/3.33.3V
  • Number of I/O
  • 408
  • RAM Size
  • 126kB
  • Clock Frequency
  • 650MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
  • 1032192
  • Number of Gates
  • 2000000
  • Number of LABs/CLBs
  • 2688
  • Speed Grade
  • 4
  • Number of Registers
  • 21504
  • Length
  • 31mm
  • Height Seated (Max)
  • 2.6mm
  • Width
  • 31mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC2V2000-4BG575I.

XC2V2000-4BG575I Overview


In the package 575-BBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 408 I/Os are programmed to ensure a more coherent data transfer. Supply voltage is 1.5V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-II series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 408 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 575. Fpga electronics is worth mentioning that this device provides 1032192 bfpga electronics s of RAM. XC2V2000 is the base part number that can be used to identify related parts. The RAM si126kBe of this FPGA module reaches 126kB so as to guarantee the normal operation of the program during operation. The device has 575 pins which are included in the design. The FPGA is built as an array of 2688 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 1.51.5/3.33.3V. A basic building block for this type of building block consists of 2000000 gates. I am going to present you with a device that is equipped with 575 pins. Fpga semiconductor typically uses a crystal oscillating at 650MHz. The structure of the registers used to store and transfer data consists of 21504 registers.

XC2V2000-4BG575I Features


408 I/Os
Up to 1032192 RAM bits
575 LABs/CLBs
21504 registers


XC2V2000-4BG575I Applications


There are a lot of Xilinx Inc.
XC2V2000-4BG575I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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Step2:Desiccant Protection

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Step3:Vacuum Packaging

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Step4:Individual Package

Step5:Anti-collision Filling

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