AMD XC2S50-5FGG256I
Manufacturer No:
XC2S50-5FGG256I
Manufacturer:
Package:
256-BGA
Description:
2.5V V 2mm mm FPGAs Spartan®-II Series 256-BGA 1mm mm 256
Quantity:
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XC2S50-5FGG256I Information
AMD XC2S50-5FGG256I technical specifications, attributes, parameters and parts with similar specifications to AMD XC2S50-5FGG256I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Number of Pins
- 256
- Number of I/Os
- 176
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-II
- Published
- 2008
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- ECCN Code
- EAR99
- Voltage - Supply
- 2.375V~2.625V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
Download datasheets and manufacturer documentation for AMD XC2S50-5FGG256I.
Datasheets:
Environmental Information:
PCN Assembly/Origin:
Product Description:
The XC2S50-5FGG256I is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc. This device is part of the Spartan-II series and is designed for a wide range of applications, including digital signal processing, data conversion, and communication systems. With its advanced architecture and high-speed performance, the XC2S50-5FGG256I is an ideal solution for demanding applications that require high-speed processing and low power consumption.
Features:
- 176 I/O pins for high-speed data transfer
- 32,768 bits of RAM for data storage and processing
- 5,000,000 gates for complex logic and arithmetic operations
- 1,728 logic elements for high-speed processing
- 384 LABs/CLBs for complex logic and arithmetic operations
- Operating supply voltage of 2.5V for low power consumption
- Operating temperature range of -40°C to 100°C for robust performance
- Surface mount packaging for easy integration into designs
- ROHS3 compliant for environmental sustainability
Applications:
- Digital signal processing
- Data conversion
- Communication systems
- Industrial control systems
- Medical devices
- Aerospace and defense systems
Alternative Parts:
- XC2S50-5FGG256C
- XC2S50-5FGG256I
- XC2S50-5FGG256J
- XC2S50-5FGG256K
Embedded Modules:
- Xilinx Spartan-II FPGA modules
- Xilinx Spartan-II LX FPGA modules
- Xilinx Virtex-II FPGA modules
FAQs:
Q: What is the maximum combinational delay of a CLB? A: The maximum combinational delay of a CLB is 0.7 ns.
Q: What is the operating supply voltage of this device? A: The operating supply voltage is 2.5V.
Q: What is the operating temperature range of this device? A: The operating temperature range is -40°C to 100°C.
Q: Is this device ROHS3 compliant? A: Yes, this device is ROHS3 compliant.
Q: What is the package type of this device? A: The package type is 256-BGA.
Q: What is the mounting type of this device? A: The mounting type is surface mount.
XC2S50-5FGG256I Relevant information
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