

AMD XC18V512PCG20C
Manufacturer No:
XC18V512PCG20C
Manufacturer:
Package:
20-LCC (J-Lead)
Description:
Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V512
Quantity:
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XC18V512PCG20C information
AMD XC18V512PCG20C technical specifications, attributes, parameters and parts with similar specifications to AMD XC18V512PCG20C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 20-LCC (J-Lead)
- Surface Mount
- YES
- Number of Pins
- 20
- Operating Temperature
- 0°C~70°C
- Packaging
- Tray
- Published
- 1999
- JESD-609 Code
- e3
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 20
- ECCN Code
- EAR99
- Terminal Finish
- Matte Tin (Sn)
- Subcategory
- Flash Memories
- Technology
- CMOS
- Voltage - Supply
- 3V~3.6V
- Terminal Position
- QUAD
- Terminal Form
- J BEND
- Peak Reflow Temperature (Cel)
- 245
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 1.27mm
- Base Part Number
- XC18V512
- Pin Count
- 20
- Operating Supply Voltage
- 3.3V
- Supply Voltage-Max (Vsup)
- 3.6V
- Supply Voltage-Min (Vsup)
- 3V
- Programmable Type
- In System Programmable
- Clock Frequency
- 33MHz
- Supply Current-Max
- 0.025mA
- Organization
- 64KX8
- Memory Width
- 8
- Density
- 512 kb
- Standby Current-Max
- 0.01A
- Access Time (Max)
- 15 ns
- Parallel/Serial
- PARALLEL/SERIAL
- Memory IC Type
- CONFIGURATION MEMORY
- Data Retention Time-Min
- 20
- Length
- 8.9662mm
- Height Seated (Max)
- 4.572mm
- Width
- 8.9662mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC18V512PCG20C.
Datasheets:
Environmental Information:
PCN Obsolescence/ EOL:
PCN Part Status Change:
XC18V512PCG20C Overview
An interesting 20-LCC (J-Lead) package is used.Packing on the outside is Tray.A qualified individual to operate within 0°C~70°C is required.This device can be programmed using In System Programmable.An electric current of 3V~3.6V is applied to it.Surface Mount is the orientation of this memory device.In addition to this part, you can search "XC18V512" for other similar parts.Supply voltage 3.3V is required.A termination with different functions in the 20 axis.With 3.6V as the maximum voltage, the memory device can be used.An operating voltage of 3V is required in order to supply the device.Using the CONFIGURATION MEMORY memory chip, we can store data.Reflow soldering should be done at no higher than 245 degrees.There are 20 pins on it.PARALLEL/SERIAL-processing is used to transmit data through this memory using the PARALLEL/SERIAL-processing algorithm.A memory chip can operate at a voltage no greater than 0.025mA.With the part are included 20 pins.An IC that can work at 33MHz frequency is a memory IC.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.I think of it as a sort of Flash Memories.
XC18V512PCG20C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V512PCG20C Applications
There are a lot of Xilinx Inc.
XC18V512PCG20C applications of configuration proms for FPGAs.
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
- Camcorders
User Guide
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