AMD XC17S30AVO8I
AMD XC17S30AVO8I

AMD XC17S30AVO8I

Manufacturer No:

XC17S30AVO8I

Manufacturer:

AMD

Package:

8-SOIC (0.154, 3.90mm Width)

Description:

Surface Mount 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

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3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

XC17S30AVO8I Information

AMD XC17S30AVO8I technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S30AVO8I.

  • Type
  • Parameter
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 8-SOIC (0.154, 3.90mm Width)
  • Surface Mount
  • YES
  • Number of Pins
  • 8
  • Operating Temperature
  • -40°C~85°C
  • Packaging
  • Tube
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Type
  • Parameter
  • Moisture Sensitivity Level (MSL)
  • 1 (Unlimited)
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • DUAL
  • Terminal Form
  • GULL WING
  • Peak Reflow Temperature (Cel)
  • 225
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V

Download datasheets and manufacturer documentation for AMD XC17S30AVO8I.

XC17S30AVO8I Overview


An interesting 8-SOIC (0.154, 3.90mm Width) package is used for this.The external packaging of Tube is made of Tube plastic.Licensed to operate in -40°C~85°C.This device can be programmed using the OTP language.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in the Surface Mount position.FPGA is limFPGAed to 300kb bytes for the size of the data storage.XC17S30 will give you other related parts.In order for it to function, it requires a voltage supply of 3.3V.Different types of 8 terminations are available with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.8 pins are located on the board.A SERIAL-processing method is used to transfer data through this memory.The memory chip will not operate at a voltage above 0.005mA.In the package, you will find a set of 8 pins.In the memory, the I/O configuration has been set to COMMON.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.

XC17S30AVO8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.


XC17S30AVO8I Applications


There are a lot of Xilinx Inc.
XC17S30AVO8I applications of configuration proms for FPGAs.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM

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Shipped from:HK Warehouse
Expected Shipping:Fri, Mar 27 - Sat, Mar 28, 2026
Date Code:Within 2 Years

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