AMD XC17S200AVOG8C

Manufacturer No:

XC17S200AVOG8C

Manufacturer:

AMD

Package:

8-SOIC (0.154, 3.90mm Width)

Description:

Surface Mount 2Mb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S200A

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XC17S200AVOG8C information

AMD XC17S200AVOG8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S200AVOG8C.

Type
Parameter

Mounting Type
Surface Mount

Package / Case
8-SOIC (0.154, 3.90mm Width)

Surface Mount
YES

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tray

Published
1999

JESD-609 Code
e3

Pbfree Code
yes

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
8

ECCN Code
EAR99

Terminal Finish
Matte Tin (Sn)

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Terminal Form
GULL WING

Peak Reflow Temperature (Cel)
260

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
1.27mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC17S200A

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
2Mb

Supply Current-Max
0.015mA

Output Characteristics
3-STATE

Memory Width
1

Standby Current-Max
0.001A

Parallel/Serial
SERIAL

I/O Type
COMMON

Memory IC Type
CONFIGURATION MEMORY

Length
4.9mm

Height Seated (Max)
1.2mm

Width
3.9mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC17S200AVOG8C.

Datasheets:

xilinx-xc17s200avog8c-datasheets-1495.pdf

XC17S200AVOG8C Overview

An interesting 8-SOIC (0.154, 3.90mm Width) package is used for this.The external packaging of Tray is made of Tray plastic.Licensed to operate in 0°C~70°C.This device can be programmed using the OTP language.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in the Surface Mount position.FPGA is limFPGAed to 2Mb bytes for the size of the data storage.XC17S200A will give you other related parts.In order for it to function, it requires a voltage supply of 3.3V.Different types of 8 terminations are available with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 260.8 pins are located on the board.A SERIAL-processing method is used to transfer data through this memory.The memory chip will not operate at a voltage above 0.015mA.In the package, you will find a set of 8 pins.In the memory, the I/O configuration has been set to COMMON.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.

XC17S200AVOG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200AVOG8C Applications

There are a lot of Xilinx Inc.
XC17S200AVOG8C applications of configuration proms for FPGAs.

servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM

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