AMD XC17S10XLPD8I
AMD XC17S10XLPD8I

AMD XC17S10XLPD8I

Manufacturer No:

XC17S10XLPD8I

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 100kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S10XL

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XC17S10XLPD8I information

AMD XC17S10XLPD8I technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S10XLPD8I.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • -40°C~85°C
  • Packaging
  • Tube
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • Not Applicable
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • DUAL
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 2.54mm
  • Base Part Number
  • XC17S10XL
  • Pin Count
  • 8
  • Operating Supply Voltage
  • 3.3V
  • Supply Voltage-Max (Vsup)
  • 3.6V
  • Supply Voltage-Min (Vsup)
  • 3V
  • Programmable Type
  • OTP
  • Clock Frequency
  • 10MHz
  • Supply Current-Max
  • 0.005mA
  • Organization
  • 95752X1
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Density
  • 93.5 kb
  • Standby Current-Max
  • 0.00005A
  • I/O Type
  • COMMON
  • Memory IC Type
  • MEMORY CIRCUIT
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XC17S10XLPD8I.

XC17S10XLPD8I Overview


A neat 8-DIP (0.300, 7.62mm) package is used.Packaging for external use.A qualified individual who has the ability to operate within -40°C~85°C.Using OTP, you can program it.A voltage of 3V~3.6V is applied to it.The memory device is mounted in Through Hole.Data storage is limited to 100kb bytes.Other related parts can be found by searching "XC17S10XL".3.3V is the required supply voltage.Different functions are associated with 8 terminations.A maximum voltage of 3.6V can be applied to this memory device.It is necessary to supply the device with a minimum voltage of 3V.A MEMORY CIRCUIT memory chip is shown here.8 pins are present.Memory chips can operate at a voltage no higher than 0.005mA.Parts come with 8 pins set.In terms of speed, this is a memory IC that operates at a 10MHz frequency.A COMMON configuration is used for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.

XC17S10XLPD8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.


XC17S10XLPD8I Applications


There are a lot of Xilinx Inc.
XC17S10XLPD8I applications of configuration proms for FPGAs.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

User Guide

PURCHASE

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IMPORTANT NOTICE

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

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3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.