AMD XC17S10XLPD8C
AMD XC17S10XLPD8C

AMD XC17S10XLPD8C

Manufacturer No:

XC17S10XLPD8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 100kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S10XL not_compliant

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC17S10XLPD8C information

AMD XC17S10XLPD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S10XLPD8C.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • 0°C~70°C
  • Packaging
  • Tube
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • Not Applicable
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • DUAL
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 2.54mm
  • Reach Compliance Code
  • not_compliant
  • Base Part Number
  • XC17S10XL
  • Pin Count
  • 8
  • Qualification Status
  • Not Qualified
  • Supply Voltage-Max (Vsup)
  • 3.6V
  • Power Supplies
  • 3.3V
  • Programmable Type
  • OTP
  • Memory Size
  • 100kb
  • Operating Mode
  • SYNCHRONOUS
  • Clock Frequency
  • 10MHz
  • Supply Current-Max
  • 0.005mA
  • Organization
  • 95752X1
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Standby Current-Max
  • 0.00005A
  • Memory Density
  • 95752 bit
  • I/O Type
  • COMMON
  • Memory IC Type
  • MEMORY CIRCUIT
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XC17S10XLPD8C.

XC17S10XLPD8C Overview


An interesting 8-DIP (0.300, 7.62mm) package is used.Packing on the outside is Tube.A qualified individual to operate within 0°C~70°C is required.This device can be programmed using OTP.An electric current of 3V~3.6V is applied to it.Through Hole is the orientation of this memory device.100kb is the maximum storage size.In addition to this part, you can search "XC17S10XL" for other similar parts.Supply voltage 3.3V is required.A termination with different functions in the 8 axis.With 3.6V as the maximum voltage, the memory device can be used.An operating voltage of 3V is required in order to supply the device.Using the MEMORY CIRCUIT memory chip, we can store data.There are 8 pins on it.A memory chip can operate at a voltage no greater than 0.005mA.With the part are included 8 pins.An IC that can work at 10MHz frequency is a memory IC.There is a COMMON configuration for the memory's I/O.You should use a 3.3V power supply.

XC17S10XLPD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.


XC17S10XLPD8C Applications


There are a lot of Xilinx Inc.
XC17S10XLPD8C applications of configuration proms for FPGAs.


  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders

User Guide

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IMPORTANT NOTICE

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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DELIVERY TIME

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