AMD XC1765EPD8I
AMD XC1765EPD8I

AMD XC1765EPD8I

Manufacturer No:

XC1765EPD8I

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 65kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1765E

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC1765EPD8I information

AMD XC1765EPD8I technical specifications, attributes, parameters and parts with similar specifications to AMD XC1765EPD8I.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • -40°C~85°C
  • Packaging
  • Tube
  • Published
  • 2000
  • JESD-609 Code
  • e0
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • Not Applicable
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Additional Feature
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
  • CMOS
  • Voltage - Supply
  • 4.5V~5.5V
  • Terminal Position
  • DUAL
  • Peak Reflow Temperature (Cel)
  • 225
  • Number of Functions
  • 1
  • Supply Voltage
  • 5V
  • Terminal Pitch
  • 2.54mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XC1765E
  • Pin Count
  • 8
  • Operating Supply Voltage
  • 5V
  • Programmable Type
  • OTP
  • Memory Size
  • 65kb
  • Clock Frequency
  • 10MHz
  • Supply Current-Max
  • 0.01mA
  • Organization
  • 64KX1
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Density
  • 64 kb
  • Standby Current-Max
  • 0.00005A
  • Parallel/Serial
  • SERIAL
  • I/O Type
  • COMMON
  • Memory IC Type
  • CONFIGURATION MEMORY
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XC1765EPD8I.

XC1765EPD8I Overview


FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.External packaging for the Tube series.-40°C~85°C license holder.OTP is the program that allows it to be programmed.This device is fed with a voltage of 4.5V~5.5V which is applied to it.There is a memory device mounted in Through Hole position for this device.There is a limit of 65kb MB for the amount of data that can be stored.Look for "XC1765E" for other related parts.The supply voltage of the device must be 5V in order to operate correctly.There are different functions that can be applied on the 8 axis when it comes to terminating.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.The reflow soldering process should be done at a temperature no higher than 225.The 8 pins are on the board.By using SERIAL-processing, data can be transmitted through this memory in a secure manner.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.As part of the package, the part comes with a set of 8 pins.I think it's important to point out that this is a memory IC that has a 10MHz frequency that can be operated at.There is a configuration of COMMON for the memory's I/O.A power supply that is rated at 5V is recommended for use with this product.Prior to the use of the part in a circuit, it is recommended that users apply the 5V to the part so that the part will run as safely and reliably as possible.Our product line now includes USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS in order to provide a better level of service to our customers.

XC1765EPD8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.


XC1765EPD8I Applications


There are a lot of Xilinx Inc.
XC1765EPD8I applications of configuration proms for FPGAs.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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Step1:Prepare product

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Step2:Desiccant Protection

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Step3:Vacuum Packaging

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Step4:Individual Package

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Step5:Anti-collision Filling

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