AMD XC17512LSO20C

Manufacturer No:

XC17512LSO20C

Manufacturer:

AMD

Package:

20-SOIC (0.295, 7.50mm Width)

Description:

Surface Mount 512kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17512L not_compliant

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XC17512LSO20C information

AMD XC17512LSO20C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17512LSO20C.

Type
Parameter

Mounting Type
Surface Mount

Package / Case
20-SOIC (0.295, 7.50mm Width)

Surface Mount
YES

Number of Pins
20

Operating Temperature
0°C~70°C

Packaging
Tube

Published
2000

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
1 (Unlimited)

Number of Terminations
20

ECCN Code
EAR99

Terminal Finish
Tin/Lead (Sn85Pb15)

Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

HTS Code
8542.32.00.61

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Terminal Form
GULL WING

Peak Reflow Temperature (Cel)
225

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
1.27mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC17512L

Pin Count
20

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
3.6V

Power Supplies
3.3V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
512kb

Operating Mode
SYNCHRONOUS

Clock Frequency
15MHz

Supply Current-Max
0.005mA

Organization
512KX1

Output Characteristics
3-STATE

Memory Width
1

Standby Current-Max
0.00005A

Memory Density
524288 bit

Parallel/Serial
SERIAL

I/O Type
COMMON

Memory IC Type
CONFIGURATION MEMORY

Length
12.827mm

Height Seated (Max)
2.6416mm

Width
7.5184mm

Download datasheets and manufacturer documentation for AMD XC17512LSO20C.

Datasheets:

xilinxinc-xc1736esog8c-datasheets-4352.pdf

xilinx-xc17512lso20c-datasheets-4332.pdf

XC17512LSO20C Overview

FPGA uses a neat 20-SOIC (0.295, 7.50mm Width) package.Tube external packaging.Qualified to operate within 0°C~70°C.FPGA is programmable through OTP.FPGA is fed wFPGAh a voltage of 3V~3.6V.This memory device is mounted in Surface Mount.The size of data storage is limited to 512kb.You can search "XC17512L" for other related parts.FPGA reuqires a supply voltage of 3.3V.20 terminations with different functions.This memory device can be used with a maximum voltage of 3.6V.To supply the device, a minimum voltage of 3V is a must.This is a CONFIGURATION MEMORY memory chip.In reflow soldering procedure, the temperature should be controlled to no higher than 225.FPGA has 20 pins.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate from a voltage no higher than 0.005mA.20 pins are set with the part.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.The memory's I/O is configured as COMMON.Memory is recommended to use a 3.3V power supply.Memory features USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS to better serve the need.

XC17512LSO20C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17512LSO20C Applications

There are a lot of Xilinx Inc.
XC17512LSO20C applications of configuration proms for FPGAs.

Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications

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