AMD XC1736EPDG8C
AMD XC1736EPDG8C

AMD XC1736EPDG8C

Manufacturer No:

XC1736EPDG8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 36kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC1736E unknown

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC1736EPDG8C information

AMD XC1736EPDG8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC1736EPDG8C.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Surface Mount
  • NO
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Number of Pins
  • 8
  • Published
  • 2004
  • Packaging
  • Tube
  • Operating Temperature
  • 0°C~70°C
  • JESD-609 Code
  • e3
  • Pbfree Code
  • yes
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 1 (Unlimited)
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Matte Tin (Sn)
  • Additional Feature
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
  • CMOS
  • Voltage - Supply
  • 4.75V~5.25V
  • Terminal Position
  • DUAL
  • Peak Reflow Temperature (Cel)
  • 250
  • Number of Functions
  • 1
  • Supply Voltage
  • 5V
  • Terminal Pitch
  • 2.54mm
  • Reach Compliance Code
  • unknown
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 8
  • Qualification Status
  • Not Qualified
  • Supply Voltage-Max (Vsup)
  • 5.25V
  • Power Supplies
  • 5V
  • Supply Voltage-Min (Vsup)
  • 4.75V
  • Programmable Type
  • OTP
  • Memory Size
  • 36kb
  • Operating Mode
  • SYNCHRONOUS
  • Clock Frequency
  • 10MHz
  • Supply Current-Max
  • 0.01mA
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Standby Current-Max
  • 0.00005A
  • Parallel/Serial
  • SERIAL
  • I/O Type
  • COMMON
  • Memory IC Type
  • CONFIGURATION MEMORY
  • Length
  • 9.3599mm
  • Width
  • 7.62mm
  • Height Seated (Max)
  • 4.5974mm
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Lead Free

Download datasheets and manufacturer documentation for AMD XC1736EPDG8C.

Datasheets:

XC1736EPDG8C Overview


8-DIP (0.300, 7.62mm) is used in this package.External packaging of type Tube.As a qualified employee, I can operate within 0°C~70°C.OTP allows for programmability.The voltage is 4.75V~5.25V.There is a memory device mounted in Through Hole.A maximum of 36kb bytes of data can be stored.For other related parts, search "XC1736E".5V is the voltage it requires as a supply.Different functions can be assigned to 8 terminations.5.25V is the maximum voltage that can be used with this memory device.4.75V is the minimum voltage required to supply the device.Using CONFIGURATION MEMORY memory chips, this is what you get.In reflow soldering, the temperature should be controlled to a maximum of 250 degrees during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.An operating voltage of 0.01mA is allowed for the memory chip.The part comes with a set of 8 pins.FPGA is a 10MHz-frequency memory IC.This memory has a COMMON configuration for its I/O.The use of 5V power supplies is recommended.For better service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.

XC1736EPDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.


XC1736EPDG8C Applications


There are a lot of Xilinx Inc.
XC1736EPDG8C applications of configuration proms for FPGAs.


  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer

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Step2：Desiccant Protection

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Step4：Individual Package

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Step5：Anti-collision Filling

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