AMD XC17256ELPD8C

Manufacturer No:

XC17256ELPD8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 256Kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17256EL

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XC17256ELPD8C information

AMD XC17256ELPD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17256ELPD8C.

Type
Parameter

Mounting Type
Through Hole

Package / Case
8-DIP (0.300, 7.62mm)

Surface Mount
NO

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tube

Published
2000

JESD-609 Code
e0

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
Not Applicable

Number of Terminations
8

ECCN Code
EAR99

Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Peak Reflow Temperature (Cel)
225

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
2.54mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC17256EL

Pin Count
8

Operating Supply Voltage
3.3V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
256Kb

Clock Frequency
15MHz

Supply Current-Max
0.005mA

Organization
256KX1

Output Characteristics
3-STATE

Memory Width
1

Density
256 kb

Standby Current-Max
0.00005A

Parallel/Serial
SERIAL

I/O Type
COMMON

Memory IC Type
CONFIGURATION MEMORY

Length
9.3599mm

Height Seated (Max)
4.5974mm

Width
7.62mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XC17256ELPD8C.

Datasheets:

xilinxinc-xc1736esog8c-datasheets-4352.pdf

XC17256ELPD8C Overview

The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.The OTP programming language can be used to program it.The voltage fed to it is 3V~3.6V.Mounted in Through Hole is this memory device.A data storage size of 256Kb is allowed.Search "XC17256EL" for related parts.The supply voltage is 3.3V.With different functions, 8 terminations can be used.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.A CONFIGURATION MEMORY memory chip like this is used for data storage.If reflow soldering is being performed, the temperature should not be higher than 225 when soldering should be reflowed.FPGA is equipped wFPGAh 8 pins.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.Parts include 8 pins.Using a 15MHz frequency, this memory IC can work at high speeds.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.Therefore, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included in order to better meet customer needs.

XC17256ELPD8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17256ELPD8C Applications

There are a lot of Xilinx Inc.
XC17256ELPD8C applications of configuration proms for FPGAs.

mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer

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