AMD XC1701LPD8C

Manufacturer No:

XC1701LPD8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 1Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1701L not_compliant

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XC1701LPD8C information

AMD XC1701LPD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC1701LPD8C.

Type
Parameter

Mounting Type
Through Hole

Package / Case
8-DIP (0.300, 7.62mm)

Surface Mount
NO

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tube

Published
2000

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
Not Applicable

Number of Terminations
8

ECCN Code
EAR99

Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Peak Reflow Temperature (Cel)
225

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
2.54mm

Reach Compliance Code
not_compliant

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC1701L

Pin Count
8

Supply Voltage-Max (Vsup)
3.6V

Power Supplies
3.3V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
1Mb

Operating Mode
SYNCHRONOUS

Clock Frequency
15MHz

Supply Current-Max
0.01mA

Organization
1MX1

Output Characteristics
3-STATE

Memory Width
1

Standby Current-Max
0.00005A

Parallel/Serial
SERIAL

I/O Type
COMMON

Memory IC Type
CONFIGURATION MEMORY

Length
9.3599mm

Height Seated (Max)
4.5974mm

Width
7.62mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XC1701LPD8C.

Datasheets:

xilinxinc-xc1736esog8c-datasheets-4352.pdf

XC1701LPD8C Overview

An interesting 8-DIP (0.300, 7.62mm) package is used.Packing on the outside is Tube.A qualified individual to operate within 0°C~70°C is required.This device can be programmed using OTP.An electric current of 3V~3.6V is applied to it.Through Hole is the orientation of this memory device.1Mb is the maximum storage size.In addition to this part, you can search "XC1701L" for other similar parts.Supply voltage 3.3V is required.A termination with different functions in the 8 axis.With 3.6V as the maximum voltage, the memory device can be used.An operating voltage of 3V is required in order to supply the device.Using the CONFIGURATION MEMORY memory chip, we can store data.Reflow soldering should be done at no higher than 225 degrees.There are 8 pins on it.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.A memory chip can operate at a voltage no greater than 0.01mA.With the part are included 8 pins.An IC that can work at 15MHz frequency is a memory IC.There is a COMMON configuration for the memory's I/O.You should use a 3.3V power supply.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.

XC1701LPD8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1701LPD8C Applications

There are a lot of Xilinx Inc.
XC1701LPD8C applications of configuration proms for FPGAs.

networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders

User Guide

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