

AMD XAZU3EG-1SFVA625I
Manufacturer No:
XAZU3EG-1SFVA625I
Manufacturer:
Package:
625-BFBGA, FCBGA
Description:
625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 128 I/O 0.85V
Quantity:
Delivery:




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In Stock :Available
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XAZU3EG-1SFVA625I information
AMD XAZU3EG-1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to AMD XAZU3EG-1SFVA625I.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 625-BFBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 625
- HTS Code
- 8542.31.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 0.85V
- Terminal Pitch
- 0.8mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- S-PBGA-B625
- Number of I/O
- 128
- Speed
- 500MHz, 1.2GHz
- RAM Size
- 1.8MB
- uPs/uCs/Peripheral ICs Type
- MICROPROCESSOR CIRCUIT
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Peripherals
- DMA, WDT
- Architecture
- MPU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 154K+ Logic Cells
- Length
- 21mm
- Height Seated (Max)
- 3.43mm
- Width
- 21mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XAZU3EG-1SFVA625I.
Datasheets:
Environmental Information:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
On this SoC, there is Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Assigned with the package 625-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 1.8MB RAM implementation of this SoC chip ensures efficient performance for users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+? MPSoC EG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+? FPGA, 154K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 128 I/Os.It is recommended to use a 0.85V power supply.In total, there are 625 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU3EG-1SFVA625I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
User Guide
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MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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