AMD XAZU3EG-1SFVA625I
AMD XAZU3EG-1SFVA625I

AMD XAZU3EG-1SFVA625I

Manufacturer No:

XAZU3EG-1SFVA625I

Manufacturer:

AMD

Package:

625-BFBGA, FCBGA

Description:

625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 128 I/O 0.85V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XAZU3EG-1SFVA625I information

AMD XAZU3EG-1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to AMD XAZU3EG-1SFVA625I.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 625-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq® UltraScale+? MPSoC EG
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 625
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.85V
  • Terminal Pitch
  • 0.8mm
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • S-PBGA-B625
  • Number of I/O
  • 128
  • Speed
  • 500MHz, 1.2GHz
  • RAM Size
  • 1.8MB
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR CIRCUIT
  • Core Processor
  • Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
  • Peripherals
  • DMA, WDT
  • Architecture
  • MPU, FPGA
  • Primary Attributes
  • Zynq®UltraScale+? FPGA, 154K+ Logic Cells
  • Length
  • 21mm
  • Height Seated (Max)
  • 3.43mm
  • Width
  • 21mm
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XAZU3EG-1SFVA625I.

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Assigned with the package 625-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 1.8MB RAM implementation of this SoC chip ensures efficient performance for users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+? MPSoC EG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+? FPGA, 154K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 128 I/Os.It is recommended to use a 0.85V power supply.In total, there are 625 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU3EG-1SFVA625I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.