AMD XA3S400A-4FTG256I

Manufacturer No:

XA3S400A-4FTG256I

Manufacturer:

AMD

Package:

256-LBGA

Description:

1.2V V FPGAs Automotive, AEC-Q100, Spartan®-3A XA Series 256-LBGA

Quantity:

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In Stock :Available

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XA3S400A-4FTG256I information

AMD XA3S400A-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to AMD XA3S400A-4FTG256I.

Type
Parameter

Factory Lead Time
15 Weeks

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
256-LBGA

Number of Pins
256

Supplier Device Package
256-FTBGA (17x17)

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Automotive, AEC-Q100, Spartan®-3A XA

Published
1999

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Max Operating Temperature
100°C

Min Operating Temperature
-40°C

Voltage - Supply
1.14V~1.26V

Base Part Number
XA3S400A

Operating Supply Voltage
1.2V

Number of I/O
195

RAM Size
45kB

Number of Logic Elements/Cells
8064

Total RAM Bits
368640

Number of Gates
400000

Number of LABs/CLBs
896

Number of Logic Blocks (LABs)
896

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XA3S400A-4FTG256I.

Datasheets:

xilinxinc-xa3s200a4ftg256i-datasheets-2815.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

XA3S400A-4FTG256I Overview

In the 256-LBGA package, you will find fpga chips. The device has 195 I/O ports for more coherent data transfer. To form a fundamental building block, there are 8064 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. The Automotive, AEC-Q100, Spartan®-3A XA Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 368640 bFpga chipss. You can find related parts by using the part number XA3S400A, which is its base part number. It is crucial that the RAM si45kBe of this FPGA module reaches 45kB so that the program can run normally. In order to make it work, 256 pins have been designed. A total of 896 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. As a result of the design of this module, the maximum operating temperature reaches 100°C. There should be a temperature difference between -40°C and the operating temperature. There are 400000 gates in its basic building block. A basic building block of this system consists of 896 logic blocks (LABs). Its supplier package is called 256-FTBGA (17x17).

XA3S400A-4FTG256I Features

195 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
100°C gates
896 logic blocks (LABs)

XA3S400A-4FTG256I Applications

There are a lot of Xilinx Inc.
XA3S400A-4FTG256I FPGAs applications.

Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense

User Guide

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