Winbond W66CP2NQQAGJ
Manufacturer No:
W66CP2NQQAGJ
Manufacturer:
Winbond
Description:
IC DRAM 4GBIT LVSTL 200TFBGA.SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 1.867 GHz 3.6 ns 200-TFBGA (10x14.5)
Quantity:
In Stock :3164
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Sat, Oct 24 - Sun, Oct 25, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
Payment
We support multiple secure payment methods including PayPal, Visa, MasterCard, and American Express. All transactions are protected with advanced encryption to ensure secure and reliable payments.
Authenticity Guarantee
All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.
Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
W66CP2NQQAGJ Information
Winbond W66CP2NQQAGJ technical specifications, attributes, parameters and parts with similar specifications to Winbond W66CP2NQQAGJ.
- Type
- Parameter
- Packaging
- Tray
- Part Status
- Active
- Manufacturer Lead Time
- 24 Weeks
- Access Time
- 3.6 ns
- Clock Frequency
- 1.867 GHz
- Memory Format
- DRAM
- Memory Interface
- LVSTL_11
- Memory Organization
- 128M x 32
- Memory Size
- 4Gbit
- Memory Type
- Volatile
- Type
- Parameter
- Mounting Type
- Surface Mount
- Operating Temperature
- -40°C ~ 105°C (TC)
- Package / Case
- 200-TFBGA
- Supplier Device Package
- 200-TFBGA (10x14.5)
- Technology
- SDRAM - Mobile LPDDR4
- Voltage - Supply
- 1.06V ~ 1.17V, 1.7V ~ 1.95V
- Write Cycle Time - Word, Page
- 18ns
- ReachStatus
- REACH Unaffected
- RoHS Status
- RoHS Compliant
W66CP2NQQAGJ FAQ
Can I request a quote for W66CP2NQQAGJ?
W66CP2NQQAGJ from Winbond is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for W66CP2NQQAGJ?
The final price for W66CP2NQQAGJ depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for W66CP2NQQAGJ?
W66CP2NQQAGJ is a Winbond Interface ICs part. Key details include Packaging: Tray and Write Cycle Time - Word, Page: 18ns and Supplier Device Package: 200-TFBGA (10x14.5); contact us if you need the specifications verified before sourcing.
When will I receive a quotation for W66CP2NQQAGJ?
After you submit the RFQ for W66CP2NQQAGJ, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for W66CP2NQQAGJ?
Once stock for W66CP2NQQAGJ is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to W66CP2NQQAGJ?
Yes. If W66CP2NQQAGJ is unavailable, end-of-life, or outside your schedule, we can review comparable Winbond Interface ICs parts and compatible replacement options.
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
