Microchip USB3300-EZK
Microchip USB3300-EZK

Microchip USB3300-EZK

Manufacturer No:

USB3300-EZK

Manufacturer:

Microchip

Package:

32-VFQFN Exposed Pad

Description:

The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver with a ULPI that allows it to act as a device, host, or an OTG device.

User Guide

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

USB3300-EZK Information

Microchip USB3300-EZK technical specifications, attributes, parameters and parts with similar specifications to Microchip USB3300-EZK.

  • Type
  • Parameter
  • BatteryChargerDetection
  • No
  • CrystalSupport
  • Yes
  • HostBasedIF
  • No
  • IOVoltage
  • 3.3V
  • IntegratedUSBSwitch
  • No
  • OTG
  • Yes
  • Reference Clock Freq
  • 24MHz
  • TempRange Max
  • 85
  • TempRange Min
  • -40
  • ULPIInputClockMode
  • No
  • Type
  • Parameter
  • Upstream Port
  • ULPI

Download datasheets and manufacturer documentation for Microchip USB3300-EZK.

The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver (PHY). The USB3300 uses a low pin count interface (ULPI) to connect to a ULPI compliant Link layer. The ULPI interface reduces the UTMI+ interface from 54 pins to 12 pins using a method of in-band signaling and status byte transfers between the Link and PHY.

This PHY was designed from the start with the ULPI interface. No UTMI to ULPI wrappers are used in this design which provides a seamless ULPI to Link interface. The result is a PHY with a low latency transmit and receive time. Microchip's low latency high speed and full speed receiver provide the option of re-using existing UTMI Links with a simple wrapper to convert UTMI to ULPI.

The ULPI interface allows the USB3300 PHY to operate as a device, host, or an On-The-Go (OTG) device. Designs using the USB3300 PHY as a device, can add host and OTG capability at a later date with no additional pins.

The ULPI interface, combined with Microchip's proprietary technology, makes the USB3300 the ideal method of adding Hi-Speed USB to new designs. The USB3300 features an industry leading small footprint package (5mm by 5mm) with sub 1mm height. In addition the USB3300 integrates all DP and DM termination resistances and requires a minimal number of external components.


Microchip's complimentary and confidential MicroCHECK design review service, which offers insight from the initial concept to the final PCB layout, is available to customers who are using our products in their projects. You can confidently submit your design materials in a secure and private setting, and our expert engineers will provide individualized feedback to enhance your design. MicroCHECK design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.



  • USB-IF Hi-Speed certified to the Universal Serial Bus Specification Rev 2.0
  • Interface compliant with the ULPI Specification revision 1.1 in 8-bit mode
  • Industry standard UTMI+ Low Pin Interface (ULPI) Converts 54 UTMI+ signals into a standard 12 pin Link controller interface
  • 54.7mA Unconfigured Current (typical) - ideal for bus powered applications
  • 83uA suspend current (typical) - ideal for battery powered applications
  • Latch-Up performance exceeds 150 mA per EIA/JESD 78, Class II
  • ESD protection levels of ±8kV HBM without external protection devices
  • Integrated protection to withstand IEC61000-4-2 ESD tests (±8kV contact and ±15kV air) per 3rd party test facility
  • Supports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3)
  • Supports HS SOF and LS keep-alive pulse
  • Includes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Supplement Revision 1.0a specification
  • Supports the OTG Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
  • Allows host to turn VBUS off to conserve battery power in OTG applications
  • Supports OTG monitoring of VBUS levels with internal comparators. Includes support for an external VBUS or fault monitor
  • Low Latency Hi-Speed Receiver (43 Hi-Speed clocks Max) allows use of legacy UTMI Links with a ULPI wrapper
  • Integrated Pull-up resistor on STP for interface protection allows a reliable Link/PHY start-up with slow Links (software configured for low power)
  • Internal 1.8 volt regulators allow operation from a single 3.3 volt supply
  • Internal short circuit protection of ID, DP and DM lines to VBUS or ground
  • Integrated 24MHz Crystal Oscillator supports either crystal operation or 24MHz external clock input
  • Internal PLL for 480MHz Hi-Speed USB operation
  • Industrial Operating Temperature -40°C to +85°C
  • 32 pin, QFN RoHS Compliant package (5 x 5 x 0.90 mm height)
    • Common Applications:
    • Cell Phones
    • Scanners
    • External Hard Drives
    • Digital Still and Video Cameras
    • Portable Media Players
    • Printers

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    Shipped from:HK Warehouse
    Expected Shipping:Mon, Mar 30 - Tue, Mar 31, 2026
    Date Code:Within 2 Years

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