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TI UCC39151DPG4
Manufacturer No:
UCC39151DPG4
Manufacturer:
TI
Package:
SOIC
Description:
1 Hot Swap Controllers SOIC 1
Quantity:
In Stock :8714
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Expected Shipping：Thu, Jun 4 - Fri, Jun 5, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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UCC39151DPG4 Information
TI UCC39151DPG4 technical specifications, attributes, parameters and parts with similar specifications to TI UCC39151DPG4.
- Type
- Parameter
- Package / Case
- SOIC
- Surface Mount
- YES
- JESD-609 Code
- e4
- Pbfree Code
- no
- Moisture Sensitivity Level (MSL)
- 2 (1 Year)
- Number of Terminations
- 16
- ECCN Code
- EAR99
- Terminal Finish
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Type
- Parameter
- HTS Code
- 8542.39.00.01
- Technology
- BICMOS
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
- Number of Functions
- 1
- Supply Voltage
- 12V
- Terminal Pitch
- 1.27mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Pin Count
- 16
Download datasheets and manufacturer documentation for TI UCC39151DPG4.
UCC39151DPG4 Overview
In the SOIC package you will find it.Channel 1 is currently available.The 16 terminations total to three.Device DUAL is located at the terminal position.The device consists of a total of 16 pins.The supply voltage 12V is necessary for high efficiency.For stable operation, the maximum operating temperature should be 70°C°C.At a minimum working temperature of 0°C degrees Celsius, it maintains its reliability.As you can see in this example, the gadget uses an analog IC called POWER SUPPLY SUPPORT CIRCUIT.An input voltage of 15VV is the maximum it can handle.Using a low supply voltage, such as 7VV, will be feasible.
UCC39151DPG4 Features
The terminal position of 16
UCC39151DPG4 Applications
There are a lot of Texas Instruments
UCC39151DPG4 hot swap controllers applications.
- Safe board insertion and extraction
- Industrial computers and servers
- Redundant-array-of-independent-disk (RAID) storage
- Other forms of communications infrastructure
- Board or blade insertion into live backplanes
- Backplane
- Loads
- Distributed power systems
- Redundant negative voltage supplies
- Central office switching systems
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