Microchip U1AFS600-FGG256
Microchip U1AFS600-FGG256

Microchip U1AFS600-FGG256

Manufacturer No:

U1AFS600-FGG256

Manufacturer:

Microchip

Package:

256-LBGA

Description:

FPGAs Fusion® Series 256-LBGA

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DHL

In Stock :4863

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Shipped from:HK Warehouse
Expected Shipping:Sun, May 17 - Mon, May 18, 2026
Date Code:Within 2 Years

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

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Step3:Vacuum Packaging

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Step4:Individual Package

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Step5:Anti-collision Filling

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SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

U1AFS600-FGG256 Information

Microchip U1AFS600-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip U1AFS600-FGG256.

  • Type
  • Parameter
  • Lifecycle Status
  • IN PRODUCTION (Last Updated: 1 month ago)
  • Factory Lead Time
  • 14 Weeks
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 256-LBGA
  • Number of Pins
  • 256
  • Supplier Device Package
  • 256-FPBGA (17x17)
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Fusion®
  • Type
  • Parameter
  • Published
  • 2013
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Max Operating Temperature
  • 85°C
  • Min Operating Temperature
  • 0°C
  • Voltage - Supply
  • 1.425V~1.575V
  • Base Part Number
  • U1AFS600
  • Number of I/O
  • 114
  • RAM Size
  • 4.5kB
  • Total RAM Bits
  • 36864

Download datasheets and manufacturer documentation for Microchip U1AFS600-FGG256.

U1AFS600-FGG256 Overview


In the package 256-LBGA, this product is provided. A total of 114 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Fusion® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 36864 bfpga electronics s of RAM. U1AFS600 is the base part number that can be used to identify related parts. The RAM si4.5kBe of this FPGA module reaches 4.5kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 85°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 250000 gates. As a supplier, 256-FPBGA (17x17) is responsible for the package of its devices.

U1AFS600-FGG256 Features


114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates


U1AFS600-FGG256 Applications


There are a lot of Microsemi Corporation
U1AFS600-FGG256 FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center