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Microchip U1AFS250-FGG256
Manufacturer No:
U1AFS250-FGG256
Manufacturer:
Microchip
Package:
256-LBGA
Description:
FPGAs Fusion® Series 256-LBGA
Quantity:
In Stock :2998
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Shipped from：HK Warehouse
Expected Shipping：Sun, May 31 - Mon, Jun 1, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step2：Desiccant Protection
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
U1AFS250-FGG256 Information
Microchip U1AFS250-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip U1AFS250-FGG256.
- Type
- Parameter
- Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- Factory Lead Time
- 14 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Supplier Device Package
- 256-FPBGA (17x17)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Fusion®
- Type
- Parameter
- Published
- 2013
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Voltage - Supply
- 1.425V~1.575V
- Base Part Number
- U1AFS250
- Number of I/O
- 114
- RAM Size
- 4.5kB
- Total RAM Bits
- 36864
Download datasheets and manufacturer documentation for Microchip U1AFS250-FGG256.
U1AFS250-FGG256 Overview
This package is included in the 256-LBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . An FPGA belonging to the Fusion® series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 36864 RAM bits in terms of its RAM si36864e. Parts related to this part can be found using its base part number U1AFS250. During the configuration of this FPGA module, the RAM si4.5kBe reaches 4.5kB to ensure that the program runs normally. The device is designed with 256 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In this module, 85°C is the maximum operating temperature at which fpga electronics can operate. Over 0°C, the operating temperature should be higher. Fpga semiconductor is made up of 250000 gates as fpga semiconductors basic building block. Device package 256-FPBGA (17x17) is provided by its supplier.
U1AFS250-FGG256 Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates
U1AFS250-FGG256 Applications
There are a lot of Microsemi Corporation
U1AFS250-FGG256 FPGAs applications.
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
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