

INFINEON TLE9461ESV33XUMA1
Manufacturer No:
TLE9461ESV33XUMA1
Manufacturer:
Package:
24-TSSOP (0.154, 3.90mm Width) Exposed Pad
Description:
System Basis Chip (SBC) Specialized ICs Automotive, AEC-Q100, Lite SBC Series
Quantity:


In Stock :7817
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
TLE9461ESV33XUMA1 Information
INFINEON TLE9461ESV33XUMA1 technical specifications, attributes, parameters and parts with similar specifications to INFINEON TLE9461ESV33XUMA1.
- Type
- Parameter
- Factory Lead Time
- 26 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 24-TSSOP (0.154, 3.90mm Width) Exposed Pad
- Usage Level
- Automotive grade
- Packaging
- Tape & Reel (TR)
- Series
- Automotive, AEC-Q100, Lite SBC
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- System Basis Chip (SBC)
- Applications
- CAN Automotive
- Type
- Parameter
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for INFINEON TLE9461ESV33XUMA1.
Product Description:
The TLE9461ESV33XUMA1 is a System Basis Chip (SBC) from Infineon Technologies, designed for automotive applications. This specialized IC is part of the Automotive, AEC-Q100, Lite SBC series, ensuring high reliability and quality for demanding automotive environments.
Features:
- 24-TSSOP (0.154, 3.90mm Width) Exposed Pad package for efficient heat dissipation
- Surface Mount mounting type for easy integration into PCBs
- Tape & Reel (TR) packaging for convenient handling and storage
- Active part status with a factory lead time of 26 weeks
- Compliant with ROHS3 standards for environmental sustainability
- Moisture Sensitivity Level (MSL) 3, with a 168-hour reflow profile
Applications:
- Primary Applications: The TLE9461ESV33XUMA1 is designed for use in automotive systems, such as:
- Body control modules
- Chassis control modules
- Infotainment systems
- Powertrain control modules
- Secondary Applications: The IC can also be used in other industries, such as:
- Industrial automation
- Medical devices
- Aerospace
Alternative Parts:
- TLE9461ESV33XUMA1 is an alternative to other System Basis Chips (SBCs) from Infineon Technologies, such as the TLE9461ESV33XUMA1.
- Other alternative parts may include ICs from other manufacturers, such as NXP or STMicroelectronics.
Embedded Modules:
- The TLE9461ESV33XUMA1 is used in various embedded modules, including:
- Body Control Modules (BCMs)
- Chassis Control Modules (CCMs)
- Infotainment Systems (IS)
- Powertrain Control Modules (PCMs)
FAQs:
Q: What is the factory lead time for the TLE9461ESV33XUMA1? A: The factory lead time for the TLE9461ESV33XUMA1 is 26 weeks.
Q: What is the Moisture Sensitivity Level (MSL) of the TLE9461ESV33XUMA1? A: The MSL of the TLE9461ESV33XUMA1 is 3, with a 168-hour reflow profile.
Q: Is the TLE9461ESV33XUMA1 ROHS compliant? A: Yes, the TLE9461ESV33XUMA1 is ROHS3 compliant.
Q: What is the package type of the TLE9461ESV33XUMA1? A: The package type of the TLE9461ESV33XUMA1 is 24-TSSOP (0.154, 3.90mm Width) Exposed Pad.
Q: What is the mounting type of the TLE9461ESV33XUMA1? A: The mounting type of the TLE9461ESV33XUMA1 is Surface Mount.
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